FPGA integrated circuit having embedded sram memory blocks with registered address and data input sections

ABSTRACT

A field-programmable gate array device (FPGA) having plural rows and columns of logic function units (VGB&#39;s) further includes a plurality of embedded memory blocks, where each memory block is embedded in a corresponding row of logic function units. Each embedded memory block has a registered address port for capturing received address signals in response to further-received, address-validating clock signals. Interconnect resources are provided for conveying the address-validating clock signals to address-changing circuitry so that a next address can be generated safely in conjunction with the capturing by the registered address port of a previous address signal.

CROSS REFERENCE TO RELATED APPLICATIONS

The following copending U.S. patent applications are owned by the ownerof the present application, and their disclosures are incorporatedherein by reference:

-   -   (A) Ser. No. 08/948,306 filed Oct. 9, 1997 by Om P. Agrawal et        al. and originally entitled, “VARIABLE GRAIN ARCHITECTURE FOR        FPGA INTEGRATED CIRCUITS”;    -   (B) (A) Ser. No. 08/996,049 filed Dec. 22, 1997 by Om P. Agrawal        et al and originally entitled, DUAL PORT SRAM MEMORY FOR        RUN-TIME USE IN FPGA INTEGRATED CIRCUITS;    -   (C) Ser. No. 08/996,361 filed Dec. 22, 1997, by Om Agrawal et        al. and originally entitled, “SYMMETRICAL, EXTENDED AND FAST        DIRECT CONNECTIONS BETWEEN VARIABLE GRAIN BLOCKS IN FPGA        INTEGRATED CIRCUITS”;    -   (D) Ser. No. 08/995,615 filed Dec. 22, 1997, by Om Agrawal et        al. and originally entitled, “A PROGRAMMABLE INPUT/OUTPUT BLOCK        (IOB) IN FPGA INTEGRATED CIRCUITS”;    -   (E) Ser. No. 08/995,614 filed Dec. 22, 1997, by Om Agrawal et        al. and originally entitled, “INPUT/OUTPUT BLOCK (IOB)        CONNECTIONS TO MAXL LINES, NOR LINES AND DENDRITES IN FPGA        INTEGRATED CIRCUITS”;    -   (F) Ser. No. 08/995,612 filed Dec. 22, 1997, by Om Agrawal et        al. and originally entitled, “FLEXIBLE DIRECT CONNECTIONS        BETWEEN INPUT/OUTPUT BLOCKs (IOBS) AND VARIABLE GRAIN BLOCKs        (VGBS) IN FPGA INTEGRATED CIRCUITS”;    -   (G) Ser. No. 08/997,221 filed Dec. 22, 1997, by Om Agrawal et        al. and originally entitled, “PROGRAMMABLE CONTROL MULTIPLEXING        FOR INPUT/OUTPUT BLOCKs (IOBs) IN FPGA INTEGRATED CIRCUITS”;    -   (H) Ser. No. 09/191,444 filed Nov. 12, 1998 by inventors Bai        Nguyen et al and originally entitled, MULTI-PORT SRAM CELL ARRAY        HAVING ISOLATION BUFFER IN EACH SRAM CELL FOR PROTECTING SRAM        CELL FROM READ NOISE;    -   (I) Ser. No. 09/235,536 filed concurrently herewith by inventors        Bai Nguyen et al and entitled, MULTI-PORT SRAM CELL ARRAY HAVING        PLURAL WRITE PATHS INCLUDING FOR WRITING THROUGH ADDRESSABLE        PORT AND THROUGH SERIAL BOUNDARY SCAN; and    -   (J) Ser. No. 09/008,762 filed Jan. 19, 1998 by inventors Om        Agrawal et al and entitled, SYNTHESIS-FRIENDLY FPGA ARCHITECTURE        WITH VARIABLE LENGTH AND VARIABLE TIMING INTERCONNECT.

CROSS REFERENCE TO RELATED PATENTS

The disclosures of the following U.S. patent are incorporated herein byreference:

-   -   (A) U.S. Pat. No. 5,212,652 issued May 18, 1993 to Om Agrawal et        al, (filed as Ser. No. 07/394,221 on Aug. 15, 1989) and        entitled, PROGRAMMABLE GATE ARRAY WITH IMPROVED INTERCONNECT        STRUCTURE;    -   (B) U.S. Pat. No. 5,621,650 issued Apr. 15, 1997 to Om Agrawal        et al, and entitled, PROGRAMMABLE LOGIC DEVICE WITH INTERNAL        TIME-CONSTANT MULTIPLEXING OF SIGNALS FROM EXTERNAL INTERCONNECT        BUSES; and    -   (C) U.S. Pat. No. 5,185,706 issued Feb. 9, 1993 to Om Agrawal et        al.

BACKGROUND

1. Field of the Invention

The invention is generally directed to integrated circuits, morespecifically to on-chip memory provided for run-time use with on-chiplogic circuits. The invention is yet more specifically directed toon-chip memory provided for run-time use within Programmable LogicDevices (PLD's), and even more specifically to a subclass of PLD's knownas Field Programmable Gate Arrays (FPGA's).

2. Description of Related Art

Field-Programmable Logic Devices (FPLD's) have continuously evolved tobetter serve the unique needs of different end-users. From the time ofintroduction of simple PLD's such as the Advanced Micro Devices 22V10™Programmable Array Logic device (PAL), the art has branched out inseveral different directions.

One evolutionary branch of FPLD's has grown along a paradigm known asComplex PLD's or CPLD's. This paradigm is characterized by devices suchas the Advanced Micro Devices MACH™ family. Examples of CPLD circuitryare seen in U.S. Pat. Nos. 5,015,884 (issued May 14, 1991 to Om P.Agrawal et al.) and 5,151,623 (issued Sep. 29, 1992 to Om P. Agrawal etal.).

Another evolutionary chain in the art of field programmable logic hasbranched out along a paradigm known as Field Programmable Gate Arrays orFPGA's. Examples of such devices include the XC2000™ and XC3000™families of FPGA devices introduced by Xilinx, Inc. of San Jose, Calif.The architectures of these devices are exemplified in U.S. Pat. Nos.4,642,487; 4,706,216; 4,713,557; and 4,758,985; each of which isoriginally assigned to Xilinx, Inc.

An FPGA device can be characterized as an integrated circuit that hasfour major features as follows.

-   -   (1) A user-accessible, configuration-defining memory means, such        as SRAM, EPROM, EEPROM, anti-fused, fused, or other, is provided        in the FPGA device so as to be at least once-programmable by        device users for defining user-provided configuration        instructions. Static Random Access Memory or SRAM is of course,        a form of reprogrammable memory that can be differently        programmed many times. Electrically Erasable and reprogrammable        ROM or EEPROM is an example of nonvolatile reprogrammable        memory. The configuration-defining memory of an FPGA device can        be formed of mixture of different kinds of memory elements if        desired (e.g., SRAM and EEPROM).    -   (2) Input/Output Blocks (IOB's) are provided for interconnecting        other internal circuit components of the FPGA device with        external circuitry. The IOB's may have fixed configurations or        they may be configurable in accordance with user-provided        configuration instructions stored in the configuration-defining        memory means.    -   (3) Configurable Logic Blocks (CLB's) are provided for carrying        out user-programmed logic functions as defined by user-provided        configuration instructions stored in the configuration-defining        memory means. Typically, each of the many CLB's of an FPGA has        at least one lookup table (LUT) that is user-configurable to        define any desired truth table, —to the extent allowed by the        address space of the LUT. Each CLB may have other resources such        as LUT input signal pre-processing resources and LUT output        signal post-processing resources. Although the term ‘CLB’ was        adopted by early pioneers of FPGA technology, it is not uncommon        to see other names being given to the repeated portion of the        FPGA that carries out user-programmed logic functions. The term,        ‘LAB’ is used for example in U.S. Pat. No. 5,260,611 to refer to        a repeated unit having a 4-input LUT.    -   (4) An interconnect network is provided for carrying signal        traffic within the FPGA device between various CLB's and/or        between various IOB's and/or between various IOB's and CLB's. At        least part of the interconnect network is typically configurable        so as to allow for programmably-defined routing of signals        between various CLB's and/or IOB's in accordance with        user-defined routing instructions stored in the        configuration-defining memory means. Another part of the        interconnect network may be hard wired or nonconfigurable such        that it does not allow for programmed definition of the path to        be taken by respective signals traveling along such hard wired        interconnect. A version of hard wired interconnect wherein a        given conductor is dedicatedly connected to be always driven by        a particular output driver, is sometimes referred to as ‘direct        connect’.

In addition to the above-mentioned basic components, it is sometimesdesirable to include on-chip reprogrammable memory that is embeddedbetween CLB's and available for run-time use by the CLB's and/orresources of the FPGA for temporarily holding storage data. Thisembedded run-time memory is to be distinguished from the configurationmemory because the latter configuration memory is generally notreprogrammed while the FPGA device is operating in a run-time mode. Theembedded run-time memory may be used in speed-critical paths of theimplemented design to implement, for example, FIFO or LIFO elements thatbuffer data words on a first-in/first-out or last-in/first-out basis.Read/write speed, data validating speed, and appropriate interconnectingof such on-chip embedded memory to other resources of the FPGA can limitthe ability of a given FPGA architecture to implement certainspeed-critical designs.

Modern FPGA's tend to be fairly complex. They typically offer a largespectrum of user-configurable options with respect to how each of manyCLB's should be configured, how each of many interconnect resourcesshould be configured, and how each of many IOB's should be configured.Rather than determining with pencil and paper how each of theconfigurable resources of an FPGA device should be programmed, it iscommon practice to employ a computer and appropriate FPGA-configuringsoftware to automatically generate the configuration instruction signalsthat will be supplied to, and that will cause an unprogrammed FPGA toimplement a specific design.

FPGA-configuring software typically cycles through a series of phases,referred to commonly as ‘partitioning’, ‘placement’, and ‘routing’. Thissoftware is sometimes referred to as a ‘place and route’ program.Alternate names may include, ‘synthesis, mapping and optimizationtools’.

In the partitioning phase, an original circuit design (which is usuallyrelatively large and complex) is divided into smaller chunks, where eachchunk is made sufficiently small to be implemented by a single CLB, thesingle CLB being a yet-unspecified one of the many CLB's that areavailable in the yet-unprogrammed FPGA device. Differently designedFPGA's can have differently designed CLB's with respectivelogic-implementing resources. As such, the maximum size of a partitionedchunk can vary in accordance with the specific FPGA device that isdesignated to implement the original circuit design. The originalcircuit design can be specified in terms of a gate level description, orin Hardware Descriptor Language (HDL) form or in other suitable form.

After the partitioning phase is carried out, each resulting chunk isvirtually positioned into a specific, chunk-implementing CLB of thedesignated FPGA during a subsequent placement phase.

In the ensuing routing phase, an attempt is made to algorithmicallyestablish connections between the various chunk-implementing CLB's ofthe FPGA device, using the interconnect resources of the designated FPGAdevice. The goal is to reconstruct the original circuit design byreconnecting all the partitioned and placed chunks.

If all goes well in the partitioning, placement, and routing phases, theFPGA configuring software will find a workable ‘solution’ comprised of aspecific partitioning of the original circuit, a specific set of CLBplacements and a specific set of interconnect usage decisions(routings). It can then deem its mission to be complete and it can usethe placement and routing results to generate the configuring code thatwill be used to correspondingly configure the designated FPGA.

In various instances, however, the FPGA configuring software may findthat it cannot complete its mission successfully on a first try. It mayfind, for example that the initially-chosen placement strategy preventsthe routing phase from completing successfully. This might occur becausesignal routing resources have been exhausted in one or more congestedparts of the designated FPGA device. Some necessary interconnections mayhave not been completed through those congested parts. Alternatively,all necessary interconnections may have been completed, but the FPGAconfiguring software may find that simulation-predicted performance ofthe resulting circuit (the so-configured FPGA) is below an acceptablethreshold. For example, signal propagation time may be too large in aspeed-critical part of the FPGA-implemented circuit. More specifically,certain synchronization signals may need to propagate from one sectionof the FPGA to another according to a particular sequence andarchitectural constraints of the FPGA device may impede this fromhappening in an efficient manner in so far as resource utilization isconcerned.

Given this, if the initial partitioning, placement and routing phases donot provide an acceptable solution, the FPGA configuring software willtry to modify its initial place and route choices so as to remedy theproblem. Typically, the software will make iterative modifications toits initial choices until at least a functional place-and-route strategyis found (one where all necessary connections are completed), and morepreferably until a place-and-route strategy is found that bringsperformance of the FPGA-implemented circuit to a near-optimum point. Thelatter step is at times referred to as ‘optimization’. Modificationsattempted by the software may include re-partitionings of the originalcircuit design as well as repeated iterations of the place and routephases.

There are usually a very large number of possible choices in each of thepartitioning, placement, and routing phases. FPGA configuring programstypically try to explore a multitude of promising avenues within afinite amount of time to see what effects each partitioning, placement,and routing move may have on the ultimate outcome. This in a way isanalogous to how chess-playing machines explore ramifications of eachmove to each chess piece on the end-game. Even when relatively powerful,high-speed computers are used, it may take the FPGA configuring softwarea significant amount of time to find a workable solution. Turn aroundtime can take more than 8 hours.

In some instances, even after having spent a large amount of time tryingto find a solution for a given FPGA-implementation problem, the FPGAconfiguring software may fail to come up with a workable solution andthe time spent becomes lost turn-around time. It may be that, because ofpacking inefficiencies, the user has chosen too small an FPGA device forimplementing too large of an original circuit.

Another possibility is that the internal architecture of the designatedFPGA device does not mesh well with the organization and/or timingrequirements of the original circuit design.

Organizations of original circuit designs can include portions that maybe described as ‘random logic’ (because they have no generally repeatingpattern). The organizations can additionally or alternatively includeportions that may be described as ‘bus oriented’ (because they carry outnibble-wide, byte-wide, or word-wide, parallel operations). Theorganizations can yet further include portions that may be described as‘matrix oriented’ (because they carry out matrix-like operations such asmultiplying two, multidimensional vectors). These are just examples oftaxonomical descriptions that may be applied to various designorganizations. Another example is ‘control logic’ which is less randomthan fully ‘random logic’ but less regular than ‘bus oriented’ designs.There may be many more taxonomical descriptions. The point being madehere is that some FPGA structures may be better suited for implementingrandom logic while others may be better suited for implementing busoriented designs or other kinds of designs. In cases where embeddedmemory is present, the architecture of the embedded memory can play animportant role in determining how well a given taxonomically-distinctdesign is accommodated. Compatibility between the embedded memoryarchitecture and the architecture of intertwined CLB's and interconnectcan also play an important role in determining how well a giventaxonomically-distinct design is accommodated.

If after a number of tries, the FPGA configuring software fails to finda workable solution, the user may choose to try again with adifferently-structured FPGA device. The user may alternatively choose tospread the problem out over a larger number of FPGA devices, or even toswitch to another circuit implementing strategy such as CPLD or ASIC(where the latter is an Application Specific hardwired design of an IC).Each of these options invariably consumes extra time and can incur morecosts than originally planned for.

FPGA device users usually do not want to suffer through such problems.Instead, they typically want to see a fast turnaround time of no morethan, say 4 hours, between the time they complete their original circuitdesign and the time a first-run FPGA is available to implement andphysically test that design. More preferably, they would want to see afast turnaround time of no more than, say 30 minutes, for successfulcompletion of the FPGA configuring software when executing on a80486-80686 PC platform (that is, a socommercially specified, IBMcompatible personal computer) and implementing a 25000 gate or less,design in a target FPGA device.

FPGA users also usually want the circuit implemented by the FPGA toprovide an optimal emulation of the original design in terms of functionpacking density, cost, speed, power usage, and so forth irrespective ofwhether the original design is taxonomically describable generally as‘random logic’, or as ‘bus oriented’, ‘memory oriented’, or as acombination of these, or otherwise.

When multiple FPGA's are required to implement a very large originaldesign, high function packing density and efficient use of FPGA internalresources are desired so that implementation costs can be minimized interms of both the number of FPGA's that will have to be purchased andthe amount of printed circuit board space that will be consumed.

Even when only one FPGA is needed to implement a given design, arelatively high function packing density is still desirable because itusually means that performance speed is being optimized due to reducedwire length. It also usually means that a lower cost member of a familyof differently sized FPGA's can be selected or that unused resources ofthe one FPGA can be reserved for future expansion needs.

In summary, end users want the FPGA configuring software to complete itstask quickly and to provide an efficiently-packed, high-speedcompilation of the functionalities provided by an original circuitdesign irrespective of the taxonomic organization of the originaldesign.

In the past, it was thought that attainment of these goals was primarilythe responsibility of the computer programmers who designed the FPGAconfiguring software. It has been shown however, that the architectureor topology of the unprogrammed FPGA can play a significant role indetermining how well and how quickly the FPGA configuring softwarecompletes the partitioning, placement, and routing tasks.

As indicated above, the architectural layout, implementation, and use ofon-chip embedded memory can also play a role in how well the FPGAconfiguring software is able to complete the partitioning, placement androuting tasks with respect to using embedded memory; and also how wellthe FPGA-implemented circuit performs in terms of propagating signalsinto, through and out of the on-chip embedded memory.

SUMMARY OF THE INVENTION

An improved FPGA device in accordance with the invention includes one ormore columns of multi-ported SRAM blocks for holding run-time storagedata.

In each such SRAM block, at least a first of the multiple ports is aread/write port (Port_1) which can receive first address signals andrespond by directing the writing of further-received first data to anaddress-defined first area of the SRAM block and which can alternativelyrespond by directing the reading of stored data from an address-definedarea of the SRAM block. A second of the multiple ports (Port_2) has atleast an independent read-capability such that the second port canreceive respective second address signals and can respond independentlyof the first port by reading stored second data from a respectiveaddress-defined area of the SRAM block.

The address signals that drive the multiple ports of each SRAM blockgenerally come from respective signal sources that have changing outputstates. In accordance with the invention, one or more address-capturingregisters are provided for a respective one or more of the multipleports of each SRAM block for capturing a respective address signal forthat port in response to an address-validating strobe signal. Theaddress-validating strobe signal is routable to the respective signalsource of the address signal so that the address-validating strobesignal may be used to enable a changing of the output state of thesignal source once the respective address signal has been captured bythe address-capturing register.

In one embodiment, an address-validating strobe signal of each SRAMblock may be coupled by userconfiguration from a special SRAM controlbus (SVIC) to crossing bidirectional interconnect lines (e.g.,tri-stated horizontal longlines) for providing timingsynchronization tothe respective signal source of the address signal so that theaddress-validating strobe signal may be used to enable a changing of theoutput state of the signal source once the respective address signal hasbeen captured by the address-capturing register.

Further in accordance with the invention, one or more data-capturingregisters are provided for a respective one or more of the multipleports of each SRAM block for capturing a respective data signal for thatport in response to a data-validating strobe signal.

When data writing is taking place, the data-validating strobe signal isroutable to the respective signal source of the data signal so that thedata-validating strobe signal may be used to enable a changing of theoutput state of the signal source once the respective data write signalhas been captured by the data-capturing register.

When data reading is taking place, the data-validating strobe signal isroutable to respective logic of the data signal destination so that thedata-validating strobe signal may be used to indicate to that logic thata valid data output state is present for the respective to-be read datasignal which has now been captured by the data-capturing register.

In one embodiment, special, vertical interconnect channels are providedadjacent to embedded SRAM columns for supplying the address-validatingstrobe signals and data-validating strobe signals to the SRAM blocks aswell as additional control signals. The control signals (which includethe address-validating and data-validating strobe signals) may bebroadcast via special longlines (SMaxL lines) to all SRAM blocks of agiven column or localized to groups of SRAM blocks in a given column byusing shorter special vertical lines (S4xL lines).

One of the features of embodiments that include the address-capturingregisters is that read operations can be performed simultaneously at themultiple ports of each SRAM block using respective, and typicallydifferent, address signals for each such port, as well as differentinterconnect lines for transferring the output data. The data output(data reading) bandwidth of the embedded memory can be therebymaximized, if such maximize bandwidth is desired. Logic circuits canengage in generating a next, new address signals even while the SRAMblocks are busy responding to register-captured, old address signals.Such pipelining of operations can help to increase overall systembandwidth.

Another of the features of embodiments that include the data-capturingregisters is that the SRAM blocks can begin responding to new addresssignals even while the destination logic blocks of old data are busyresponding to register-captured, old data signals. Such pipelining ofoperations can help to increase overall system bandwidth.

Other aspects of the invention will become apparent from the belowdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The below detailed description makes reference to the accompanyingdrawings, in which:

FIG. 1 illustratesFIGS. 1A and 1B illustrate a first FPGA having an 8×8matrix of VGB's (Variable Grain Blocks) with an embedded left memorycolumn (LMC) and an embedded right memory column (RMC) in accordancewith the invention;

FIG. 2 is a diagram showing the placement of switch boxes along doublelength, quad length, and octal length lines within normal interconnectchannels of another, like FPGA device having a 20×20 matrix of VGB'swith embedded LMC and RMC;

FIG. 3 illustratesFIGS. 3A and 3B illustrate more details of a RightMemory Column (RMC), and in particular of two adjacent memory blocks andof the relation of the memory blocks to an adjacent super-VGB core tileand its horizontal interconnect channels (HIC's);

FIG. 4 illustrates how the 2/4/8xL output lines of respective CBB's (X,Z, W, Y) within a SVGB are configurably couplable to surroundinginterconnect channels;

FIG. 5 illustrates how MaxL line drivers of respective SVGB's arecoupled to surrounding interconnect channels;

FIG. 6A shows one embodiment of a VGB;

FIG. 6B shows an exemplary CSE (Configurable Sequential Element) havinga flip flop that is responsive to a VGB clock signal;

FIG. 7A illustrates how the MaxL line drivers of respective IOB's arecoupled to surrounding interconnect channels in one embodiment of theinvention;

FIG. 7B illustrates internal components of an exemplary IOB(configurable Input/Output Block)having plural flip flops that arerespectively responsive to respective IOB input and output clocksignals;

FIG. 7C illustrates an exemplary IOB controls-acquiring multiplexer thatmay be used for acquiring respective IOB input and output clock signalsfrom neighboring interconnect lines;

FIG. 8 is a further magnified illustration of one embodiment of FIG. 3,showing further details of a Right Memory Column (RMC), and inparticular of a given SRAM block in accordance with the invention andits neighboring interconnect channels;

FIG. 9 is a further magnified illustration of one embodiment of FIG. 8,showing further details inside of a given SRAM block;

FIG. 10 is a block diagram of embodiments of FPGA devices, includingthose conform with FIG. 9 as one set of alternatives, wherein respectiveflows may be seen for respective address signals, address-validatingstrobe signals, memory data signals, and memory data-validating strobesignals of dual-ported SRAM block; and

FIG. 11A is a schematic diagram of an FPGA configuring process wherein apredefined design definition is supplied to an FPGA compiling softwaremodule; and

FIG. 11B is a flow chart of FPGA-configuration software that takesadvantage of the ability to configurably route respectiveaddress-validating strobe signals and data-validating strobe signals inFPGA devices that conform to the present invention.

DETAILED DESCRIPTION

FIG. 1 shows a macroscopic view of an FPGA device 100 in accordance withthe invention. The illustrated structure is preferably formed as amonolithic integrated circuit.

The macroscopic view of FIG. 1 is to be understood as being taken at amagnification level that is lower than later-provided, microscopicviews. The more microscopic views may reveal greater levels of detailwhich may not be seen in more macroscopic views. And in counter to that,the more macroscopic views may reveal gross architectural features whichmay not be seen in more microscopic views. It is to be understood thatfor each more macroscopic view, there can be many alternate microscopicviews and that the illustration herein of a sample microscopic view doesnot limit the possible embodiments of the macroscopically viewed entity.Similarly, the illustration herein of a sample macroscopic view does notlimit the possible embodiments into which a microscopically viewedembodiment might be included.

FPGA device 100 comprises a regular matrix of super structures definedherein as super-VGB's (SVGB's). In the illustrated embodiment, a dashedbox(upper left corner) circumscribes one such super-VGB structure whichis referenced as 101. There are four super-VGB's shown in each super rowof FIG. 1 and also four super-VGB's shown in each super column. Eachsuper row or column contains plural rows or columns of VGB's. One supercolumn is identified as an example by the braces at 111. Larger matriceswith more super-VGB's per super column and/or super row are of coursecontemplated. FIG. 1 is merely an example.

There is a hierarchy of user-configurable resources within eachsuper-VGB. At a next lower level, each super-VGB is seen to contain fourVGB's. In the illustrated embodiment, identifier 102 points to one suchVGB within SVGB 101.

A VGB is a Variable Grain Block that includes its own hierarchy of userconfigurable resources. At a next lower level, each VGB is seen tocontain four Configurable Building Blocks or CBB's arranged in aL-shaped configuration. In the illustrated embodiment, identifier 103points to one such CBB within VGB 102.

At a next lower level, each CBB has its own hierarchy of userconfigurable resources. Some of these (e.g., a CSE) will be shown inlater figures. A more detailed description of the hierarchal resourcesof the super-VGB's, VGB's, CBB's, and so forth, may be found in theabove-cited Ser. No. 08/948,306filed Oct. 9, 1997 by Om P. Agrawal etal. and originally entitled, VARIABLE GRAIN ARCHITECTURE FOR FPGAINTEGRATED CIRCUITS, whose disclosure is incorporated herein byreference.

It is sufficient for the present to appreciate that each CBB includes aclocked flip flop and that each CBB is capable of producing at least onebit of result data and/or storing one bit of data in its flip flopand/or of outputting the stored and/or result data to adjacentinterconnect lines. Each VGB (102) is in turn, therefore capable ofproducing and outputting at least 4 such result bits at a time toadjacent interconnect lines. This is referred to as nibble-wideprocessing. Nibble-wide processing may also be carried out by the fourCBB's that line the side of each SVGB (e.g., 101).

With respect to the adjacent interconnect lines (AIL's), each SVGB isbounded by two horizontal and two vertical interconnect channels (HIC'sand VIC's). An example of a HIC is shown at 150. A sample VIC is shownat 160. Each such interconnect channel contains a diverse set ofinterconnect lines as will be seen later.

The combination of each SVGB (e.g., 101) and its surroundinginterconnect resources (of which resources, not all are shown in FIG. 1)is referred to as a matrix tile. Matrix tiles are tiled one to the nextas seen, with an exception occurring about the vertical sides of the twocentral, super columns, 115. Columns 114 (LMC) and 116 (RMC) of embeddedmemory are provided along the vertical sides of the central pair 115 ofsuper columns. These columns 114, 116 will be examined in closer detailshortly.

From a more generalized perspective, the tiling of the plural tilescreates pairs of adjacent interconnect channels within the core of thedevice 100. An example of a pair of adjacent interconnect channels isseen at HIC's 1 and 2. The peripheral channels (HIC0, HIC7, VIC0, VIC7)are not so paired. Switch matrix boxes (not shown, see FIG. 2) areprovided at the intersections of the respective vertical and horizontalinterconnect channels. The switch matrix boxes form part of each matrixtile construct that includes a super-VGB at its center. See area 465 ofFIG. 3.

The left memory column (LMC) 114 is embedded as shown to the left ofcentral columns pair 115. The right memory column (RMC) 116 is furtherembedded as shown to the right of the central columns pair 115. It iscontemplated to have alternate embodiments with greater numbers of suchembedded memory columns symmetrically distributed in the FPGA device andconnected in accordance with the teachings provided herein for theillustrative pair of columns, 114 and 116. It is also possible toadditionally have embedded rows of such embedded memory extendinghorizontally.

Within the illustrated LMC 114, a first, special, vertical interconnectchannel (SVIC) 164 is provided adjacent to respective, left memoryblocks MLO through ML7. Within the illustrated RMC 164, a second,special, vertical interconnect channel (SVIC) 166 is provided adjacentto respective, right memory blocks MRO through MR7.

As seen, the memory blocks, ML0-ML7 and MR0-MR7 are numbered inaccordance with the VGB row they sit in (or the HIC they are closest to)and are further designated as left or right (L or R) depending onwhether they are respectively situated in LMC 114 or RMC 116. In oneembodiment, each of memory blocks, ML0-ML7 and MR0-MR7 is organized tostore and retrieve an addressable plurality of nibbles, where a nibblecontains 4 data bits. More specifically, in one embodiment, each ofmemory blocks, ML0-ML7 and MR0-MR7 has an internal SRAM array organizedas a group of 32 nibbles (32×4=128 bits) where each nibble isindividually addressable by five address bits. The nibble-wiseorganization of the memory blocks, ML0-ML7 and MR0-MR7 corresponds tothe nibble-wise organization of each VGB (102) and/or to the nibble-wiseorganization of each group of four CBB's that line the side of each SVGB(101). Thus, there is a data-width match between each embedded memoryblock and each group of four CBB's or VGB. As will be seen a similarkind of data-width matching also occurs within the diversified resourcesof the general interconnect mesh.

At the periphery of the FPGA device 100, there are three input/outputblocks (IOB's) for each row of VGB's and for each column of VGB's. Onesuch IOB is denoted at 140. The IOB's in the illustrated embodiment areshown numbered from 1 to 96. In one embodiment, there are no IOB'sdirectly above and below the LMC 114 and the RMC 116. In an alternateembodiment, special IOB's such as shown in phantom at 113 are providedat the end of each memory column for driving address and control signalsinto the corresponding memory column.

Each trio of regular IOB's at the left side (1-24) and the right side(49-72) of the illustrated device 100 may be user-configured to coupledata signals to the nearest HIC. Similarly, each trio of regular IOB'son the bottom side (25-48) and top side (73-96) may be user-configuredfor exchanging input and/or output data signals with lines inside thenearest corresponding VIC. The SIOB's (e.g., 113), if present, may beuserconfigured to exchange signals with the nearest SVIC (e.g., 164).Irrespective of whether the SIOB's (e.g., 113) are present, data may beinput and/or output from points external of the device 100 to/from theembedded memory columns 114, 116 by way of the left side IOB's (1-24)and the right side IOB's (49-72) using longline coupling, as will beseen below. The longline coupling allows signals to move withessentially same speed and connectivity options from/to either of theleft or right side IOB's (1-24, 49-72) respectively to/from either ofthe left or right side memory columns.

It is sufficient for the present to appreciate that each IOB includesone or more clocked flip flops and that each IOB is capable of receivingat least one bit of external input data from a point outside the FPGAdevice, and/or outputting at least one bit of external output data to apoint outside the FPGA device, and/or storing one bit of input or outputdata in respective ones of its one or more flip flops, and/or oftransferring such external input or output data respectively to or fromadjacent interconnect lines. Each set of 24 IOB's that lie adjacent to acorresponding one of the peripheral HIC's and VIC's may thereforetransfer in parallel, as many as 24 I/O bits at a time. Suchtransference may couple to the adjacent one of the peripheral HIC's andVIC's and/or to neighboring VGB's.

Data and/or address and/or control signals may be generated within theFPGA device 100 by its internal VGB's and transmitted to the embeddedmemory 114, 116 by way of the peripheral and inner HIC's, as will beseen below.

The VGB's are numbered according to their column and row positions.Accordingly, VGB(0,0) is in the top left corner of the device 100,VGB(7,7) is in the bottom right corner of the device 100; and VGB(1,1)is in the bottom right corner of SVGB 101.

Each SVGB (101) may have centrally-shared resources. Suchcentrally-shared resources are represented in FIG. 1 by thediamond-shaped hollow at the center of each illustrated super-VGB (e.g.,101). Longline driving amplifiers (see FIG. 5) correspond with thesediamond-shaped hollows and have their respective outputs couplingvertically and horizontally to the adjacent HIC's and VIC's of theirrespective superVGB's.

As indicated above, each super-VGB in FIG. 1 has four CBB's along eachof its four sides. The four CBB's of each such interconnect-adjacentside of each super-VGB can store a corresponding four bits of resultdata internally so as to define a nibble of data for output onto theadjacent interconnect lines. At the same time, each VGB contains fourCBB's of the L-shaped configuration which can acquire and process anibble's worth of data. One of these processes is nibble-wide additionwithin each VGB as will be described below. Another of these processesis implementation of a 4:1 dynamic multiplexer within each CBB. Thepresentation of CBB's in groups of same number (e.g., 4 per side of asuper-VGB and 4 within each VGB) provides for a balanced handling ofmulti-bit data packets along rows and columns of the FPGA matrix. Forexample, nibbles may be processed in parallel by one column of CBB's andthe results may be efficiently transferred in parallel to an adjacentcolumn of CBB's for further processing. Such nibble-wide handling ofdata also applies to the embedded memory columns 114/116. As will beseen, nibble-wide data may be transferred between one or more groups offour CBB's each to a corresponding one or more blocks of embedded memory(MLx or MRx) by way of set of 4 equally-long lines in a nearby HIC. Eachsuch set of 4 equally-long lines may be constituted by so-called,double-length lines (2xL lines), quad-length lines (4xL lines),octal-length lines (8xL lines) or maximum length longlines (MaxL lines).

In one particular embodiment of the FPGA device, the basic matrix is10-by-10 SVGB's, with embedded memory columns 114/116 positioned aroundthe central two super columns 115. (See FIG. 2.) In that particularembodiment, the integrated circuit may be formed on a semiconductor diehaving an area of about 100,000 mils² or less. The integrated circuitmay include four metal layers for forming interconnect. So-called‘direct connect’ lines and ‘longlines’ of the interconnect arepreferably implemented entirely by the metal layers so as to provide forlow resistance pathways and thus relatively small RC time constants onsuch interconnect lines. Logic-implementing transistors of theintegrated circuit have drawn channel lengths of 0.35 microns or 0.25microns or less. Amplifier output transistors and transistors used forinterfacing the device to external signals may be larger, however.

As indicated above, the general interconnect channels (e.g., HIC 150,VIC 160 of FIG. 1) contain a diverse set of interconnect lines. FIG. 2shows a distribution 200 of different-length horizontal interconnectlines (2xL, 4xL, 8xL) and associated switch boxes of a single horizontalinterconnect channel (HIC) 201, as aligned relative to verticalinterconnect channels in an FPGA of the invention. This particular FPGAhas a 10×10 matrix of super-VGB's (or a 20×20 matrix of VGB's). Theembedded memory columns (114/116) are not fully shown, but areunderstood to be respectively embedded in one embodiment, between VIC's7-8 and 11-12, as indicated by zig-zag symbols 214 and 216.

For an alternate embodiment, symbol 214 may be placed between VIC's 6and 7 while symbol 216 is placed between VIC's 12 and 13 to indicate thealternate placement of the embedded memory columns 114/116 between saidVIC's in the alternate embodiment. For yet another alternate embodiment,zig-zag symbol 214 may be placed between VIC's 8 and 9 while zig-zagsymbol 216 is placed between VIC's 10 and 11 to represent correspondingplacement of the embedded memory columns 114/116 in the correspondinglocations. Of course, asymmetrical placement of the embedded memorycolumns 114/116 relative to the central pair of SVGB columns (115) isalso contemplated. In view of these varying placement possibilities, thebelow descriptions of which 2xL, 4xL, or 8xL line intersects withcorresponding columns 214/216 should, of course, be read ascorresponding to the illustrated placement of symbols 214 and 216respectively between VIC's 7-8 and VIC's 11-12 with correspondingadjustments being made if one of the alternate placements of 214/216 ischosen instead.

By way of a general introduction to the subject of interconnectresources, it should be noted that the interconnect mesh of FPGA 100includes lines having different lengths. It may be said that, withouttaking into account any length changes created by the imposition of theembedded memory columns 114/116, the horizontally-extending generalinterconnect channels (HIC's) and vertically-extending generalinterconnect channels (VIC's) of the FPGA device 100 are provided withessentially same and symmetrically balanced interconnect resources fortheir respective horizontal (x) and vertical (y) directions. Theseinterconnect resources include a diversified and granulated assortmentof MaxL lines, 2xL lines, 4xL lines and 8xL lines as well ascorresponding 2xL switch boxes, 4xL switch boxes, and 8xL boxes.

In one embodiment, each general channel, such as the illustrated examplein FIG. 2 of HIC 201 (the horizontal interconnect channel), contains atleast the following resources: eight double-length (2xL) lines, fourquad-length (4xL) lines, four octal-length (8xL) lines, sixteenfull-length (MaxL) lines, sixteen directconnect (DC) lines, eightfeedback (FB) lines and two dedicated clock (CLK) lines. Vertical onesof the general interconnect channels (VIC's) may contain an additionalglobal reset (GR) longline. Parts of this total of 58/59 lines may beseen in FIGS. 4 and 5 as having corresponding designations AILO throughAIL57/58 for respective interconnect lines that are adjacent tocorresponding VGB's. Not all of the different kinds of lines are shownin FIG. 2. Note that each of the 2xL, 4xL, 8xL and MaxL line setsincludes at least four lines of its own kind for carrying acorresponding nibble's worth of data or address or control signals.

In FIG. 2, core channels 1 through 18 are laid out as adjacent pairs ofodd and even channels. Peripheral channels 0 and 19 run alone along sidethe IOB's (see FIG. 1). Although not shown in FIG. 2, it should beunderstood that each switch box has both horizontally-directed andvertically-directed ones of the respective 2xL, 4xL, and 8xL linesentering into that respective switch box. (See region 465 of FIG. 3.) Agiven switchbox (XxSw) may be user-configured to continue a signal alongto the next XxL line (e.g., 2xL line) of a same direction and/or tocouple the signal to a corresponding same kind of XxL line of anorthogonal direction. A more detailed description of switchboxes for oneembodiment may be found in the above-cited, U.S. Ser. No. 09/008,762,filed Jan. 19, 1998 by inventors Om Agrawal et al whose disclosure isincorporated herein by reference.

Group 202 represents the 2xL lines of HIC 201 and their correspondingswitch boxes. For all of the 2xL lines, each such line spans thedistance of essentially two adjacent VGB's (or one super-VGB). Most 2xLlines terminate at both ends into corresponding 2x switch boxes(2xSw's). The terminating 2xSw boxes are either both in even-numberedchannels or both in odd-numbered channels. Exceptions occur at theperiphery where either an odd or even-numbered channel is nonexistent.As seen in the illustrated embodiment 200, interconnections can be madevia switch boxes from the 2xL lines of HIC 201 to any of the odd andeven-numbered vertical interconnect channels (VIC's) 0-19.

With respect to the illustrated placement 214/216 of embedded memorycolumns 114/116, note in particular that 2xL line 223 and/or its like(other, similarly oriented 2xL lines) may be used to provide ashort-haul, configurable connection from SVGB 253 (the one positioned tothe right of VIC #6) to LMC 214. Similarly, line 224 and its like may beused to provide a short-haul connection from SVGB 254 (the onepositioned to the right of VIC #8) to LMC 214. Line 225 and/or its likemay be used to provide a short-haul connection from SVGB 255 to RMC 216.Line 226 and/or its like may be used to provide a short-haul connectionfrom SVGB 256 to RMC 216. Such short-haul connections may be useful forquickly transmitting speed-critical signals such as address signalsand/or data signals between a nearby SVGB (253-256) and thecorresponding embedded memory column 114 or 116.

Group 204 represents the 4xL lines of HIC 201 and their correspondingswitch boxes. Most 4xL lines each span the distance of essentially four,linearly-adjacent VGB's and terminate at both ends into corresponding 4xswitch boxes (4xSw's). The terminating 4xSw boxes are either both ineven-numbered channels or both in odd-numbered channels. As seen in theillustrated embodiment 200, interconnections can be made via switchboxes from the 4xL lines of HIC 201 to any of the odd and evennumberedvertical interconnect channels (VIC's) 0-19.

With respect to the illustrated placement 214/216 of embedded memorycolumns 114/116, note in particular that 4xL line 242 and/or its like(other, similarly oriented 4xL lines that can provide generally similarcoupling) may be used to provide a medium-haul configurable connectionbetween LMC 214 and either one or both of SVGB 252 and SVGB 253. Line243 and/or its like may be used to provide a configurable connection ofmedium-length between LMC 214 and either one or both of SVGB's 253 and254. Similarly, line 245 and/or its like may be used to providemedium-length coupling between RMC 216 and either one or both of SVGB's255 and 256. Moreover, line 247 and/or its like may be used toconfigurably provide medium-haul interconnection between RMC 216 andeither one or both of SVGB's 257 and 256. Such medium-haulinterconnections may be useful for quickly propagating address signalsand/or data signals in comparatively medium-speed applications.

Group 208 represents the 8xL lines of HIC 201 and their correspondingswitch boxes. Most 8xL lines (7 out of 12) each spans the distance ofessentially eight, linearly-adjacent VGB's. A fair number of other 8xLlines (5 out of 12) each spans distances less than that of eight,linearly-adjacent VGB's. Each 8xL line terminates at least one end intoa corresponding 8x switch box (8xSw). The terminating 8xSw boxes areavailable in this embodiment only in the core oddnumbered channels (1,3, 5, 7, 9, 11, 13, 15 and 17). Thus, in embodiment 200,interconnections can be made via switch boxes from the 8xL lines of HIC201 to any of the nonperipheral, odd-numbered vertical interconnectchannels (VIC's). It is within the contemplation of the invention tohave the 8xSw boxes distributed symmetrically in other fashions suchthat even-numbered channels are also covered.

With respect to the illustrated placement 214/216 of embedded memorycolumns 114/116, note in particular that 8xL line 281 or its like may beused to provide even longer-haul, configurable connection from betweenLMC 214 and any one or more of SVGB's 251-254. (In one embodiment where214 places to the left of VIC 7, 8xL line 280 provides configurableinterconnection between LMC 214 and any one or more of SVGB's 250-253.)In the illustrated embodiment, 8xL line 282 may be used to provide 8xLcoupling between any two or more of: LMC 214 and SVGB's 252-255. Line283 may be used to provide 8xL coupling between any two or more of: LMC214, RMC 216, and SVGB's 253-256. Line 284 may be used to provide 8xLcoupling between any two or more of: LMC 214, RMC 216, and SVGB's254-257. Line 285 may be used to provide 8xL coupling between any two ormore of: RMC 216 and SVGB's 255-258. Line 286 may be similarly used toprovide 8xL coupling between any two or more of: RMC 216 and SVGB's256-259. Although the largest of the limited-length lines is 8xL in theembodiment of FIG. 2, it is within the contemplation of the invention tofurther have 16xL lines, 32xL lines and so forth in arrays with largernumbers of VGB's.

In addition to providing configurable coupling between the intersectingmemory channel 214 and/or 216, each of the corresponding 2xL, 4xL, 8xLand so forth lines may be additionally used for conveying such signalsbetween their respective switchboxes and corresponding components of theintersecting memory channel.

Referring briefly back to FIG. 1, it should be noted that the twocentral super columns 115 are ideally situated for generating addressand control signals and broadcasting the same by way of short-haulconnections to the adjacent memory columns 114 and 116. High-speed datamay be similarly conveyed from the memory columns 114/116 to the SVGB'sof central columns 115.

Before exploring more details of the architecture of FPGA device 100, itwill be useful to briefly define various symbols that may be used withinthe drawings. Unless otherwise stated, a single line going into atrapezoidal multiplexer symbol is understood to represent an input busof one or more wires. Each open square box (MIP) along such a busrepresents a point for user-configurable acquisition of a signal from acrossing line to the multiplexer input bus. In one embodiment, a PIP(programmable interconnect point) is placed at each MIP occupiedintersection of a crossing line and the multiplexer input bus. Each ofPIP (which may be represented herein as a hollow circle) is understoodto have a single configuration memory bit controlling its state. In theactive state the PIP creates a connection between its crossing lines. Inthe inactive state the PIP leaves an open between the illustratedcrossing lines. Each of the crossing lines remains continuous however inits respective direction (e.g., x or y).

PIP's (each of which may be represented herein by a hollow circlecovering a crossing of two continuous lines) may be implemented in avariety of manners as is well known in the art. In one embodiment passtransistors such as MOSFET's may be used with their source and drainrespectively coupled to the two crossing lines while the transistor gateis controlled by a configuration memory bit. In an alternate embodiment,nonvolatilely-programmable floating gate transistors may be used withtheir source and drain respectively coupled to the crossing lines. Thecharge on the floating gate of such transistors may represent theconfiguration memory bit. A dynamic signal or a static turn-on voltagemay be applied to the control gate of such a transistor as desired. Inyet another alternate embodiment, nonvolatilely-programmable fuses oranti-fuses may be provided as PIP's with their respective ends beingconnected to the crossing lines. One may have bidirectional PIP's forwhich signal flow between the crossing lines (e.g., 0 and 1) can move ineither direction. Where desirable, PIP's can also be implemented withunidirectional signal coupling means such as AND gates, tri-statedrivers, and so forth.

An alternate symbol for a group of PIP's is constituted herein by ahollow and tilted ellipse covering a bus such as is seen in FIG. 10.

Another symbol that may be used herein is a hollow circle with an ‘X’inside. This represents a POP. POP stands for ‘Programmable OpeningPoint’. Unless otherwise stated, each POP is understood to have a singleconfiguration memory bit controlling its state. In the active state thePOP creates an opening between the colinear lines entering it fromopposing sides. In the inactive state the POP leaves closed an impliedconnection between the colinear lines entering it. Possibleimplementations of POP's include pass transistors and tri-state drivers.Many other alternatives will be apparent to those skilled in the art.

Referring now to FIG. 3, this figure provides a mid-scopic view of somecomponents within an exemplary matrix tile 400 that lays adjacent toembedded memory column, RMC 416. Of course, other implementations arepossible for the more macroscopic view of FIG. 1.

The mid-scopic view of FIG. 3 shows four VGB's brought tightly togetherin mirror opposition to one another. The four, so-wedged together VGB'sare respectively designated as (0,0), (0,1), (1,0) and (1,1). The fourVGB's are also respectively and alternately designated herein as VGB_A,VGB_B, VGB_C, and VGB_D.

Reference number 430 points to VGB_A which is located at relative VGBrow and VGB column position (0,0). Some VGB internal structures such asCBB's Y, W, Z, and X are visible in the mid-scopic view of FIG. 3. Anexample of a Configurable Building Block (CBB) is indicated by 410. Asseen, the CBB's 410 of each VGB 430 are arranged in an L-shapedorganization and placed near adjacent interconnect lines. Further VGBinternal structures such as each VGB's common controls developing (Ctrl)section, each VGB's wide-gating supporting section, each VGB'scarry-chaining (Fast Carry) section, and each VGB's coupling to a sharedcircuit 450 of a corresponding super-structure (super-VGB) are alsovisible in the mid-scopic view of FIG. 3. VGB local feedback buses suchas the L-shaped structure shown at 435 in FIG. 3 allow for high-speedtransmission from one CBB to a next within a same VGB, of result signalsproduced by each CBB.

The mid-scopic view of FIG. 3 additionally shows four interconnectchannels surrounding VGB's (0,0) through (1,1). The top and bottom,horizontally extending, interconnect channels (HIC's) are respectivelyidentified as 451 and 452. The left and right, vertically extending,interconnect channels (VIC's) are respectively identified as 461 and462.

Two other interconnect channels that belong to other tiles are partiallyshown at 453 (HIC2) and 463 (VIC2) so as to better illuminate thecontents of switch boxes area 465. Switch boxes area 465 contains anassortment of 2xL switch boxes, 4x switch boxes and 8x switch boxes,which may be provided in accordance with FIG. 2.

In addition, a memory-control multiplexer area 467 is provided alongeach HIC as shown for configurably coupling control signals from thehorizontal bus (e.g., HIC 452) to special vertical interconnect channel(SVIC) 466. The illustrated placement of multiplexer area 467 to theright of the switch boxes (SwBoxes) of VIC's 462 and 463 is just onepossibility. Multiplexer area 467 may be alternatively placed between orto the left of the respective switch boxes of VIC's 462 and 463.

In one embodiment (see FIG. 8), SVIC 466 has sixteen, special maximumlength lines (16 SMaxL lines), thirty-two, special quad length lines (32S4xL lines), and four special clock lines (SCLK0-3). SVIC 466 carriesand couples control signals to respective control input buses such as471, 481 of corresponding memory blocks such as 470, 480.

A memory-I/O multiplexer area 468 is further provided along each HIC forconfigurably coupling memory data signals from and to the horizontal bus(e.g., HIC 452) by way of data I/O buses such as 472, 482 ofcorresponding memory blocks such as 470, 480. Again, the illustratedplacement of multiplexer area 468 to the right of the switch boxes(SwBoxes) of VIC's 462 and 463 is just one possibility. Multiplexer area468 may be alternatively placed between or to the left of the respectiveswitch boxes of VIC's 462 and 463.

Memory control multiplexer area 477 and memory I/O multiplexer area 478are the counterparts for the upper HIC 451 of areas 467 and 468 of lowerHIC 452. Although not specifically shown, it is understood that thecounterpart, left memory channel (LMC) is preferably arranged in mirrorsymmetry to the RMC 416 so as to border the left side of itscorresponding matrix tile.

As seen broadly in FIG. 3, the group of four VGB's (0,0) through (1,1)are organized in mirror image relationship to one another relative tocorresponding vertical and horizontal centerlines (not shown) of thegroup and even to some extent relative to diagonals (not shown) of thesame group. Vertical and horizontal interconnect channels (VIC's andHIC's) do not cut through this mirror-wise opposed congregation ofVGB's. As such, the VGB's may be wedged-together tightly.

Similarly, each pair of embedded memory blocks (e.g., 470 and 480), andtheir respective memory-control multiplexer areas (477 and 467), andtheir respective memory-I/O multiplexer areas (478 and 468) areorganized in mirror image relationship to one another as shown.Horizontal interconnect channels (HIC's) do not cut through thismirror-wise opposed congregation of embedded memory constructs. As such,the respective embedded memory constructs of blocks MRx0 (in an evenrow, 470 being an example) and MRx1 (in an odd row, 480 being anexample) may be wedged-together tightly. A compact layout may be therebyachieved.

With respect to mirror symmetry among variable grain blocks, VGB (0,1)may be generally formed by flipping a copy of VGB (0,0) horizontally.VGB (1,1) may be similarly formed by flipping a copy of VGB (0,1)vertically. VGB (1,0) may be formed by flipping a copy of VGB (1,1)horizontally, or alternatively, by flipping a copy of VGB (0,0)vertically. The mirror-wise symmetrical packing-together of the fourVGB's (0,0 through 1,1) is referred to herein as a ‘Super Variable GrainBlock’ or a super-VGB 440.

In a preferred embodiment, the mirror symmetry about the diagonals ofthe super-VGB is not perfect. For example, there is a Fast Carry sectionin each VGB that allows VGB's to be chained together to formmulti-nibble adders, subtractors or counters. (A nibble is a group of 4data bus. A byte is two nibbles or 8 data bits. A counter generallystores and feeds back its result so as to provide cumulative addition orsubtraction.) The propagation of rippled-through carry bits for theseFast Carry sections is not mirror wise symmetrical about the diagonalsof each super-VGB 440. Instead it is generally unidirectional alongcolumns of VGB's. Thus, CBB's X, Z, W, and Y are not interchangeable forall purposes.

The unidirectional propagation of carry bits is indicated for example byspecial direct connect lines 421a, 421b and 421c which propagate carrybits upwardly through the Fast Carry portions of VGB's (0,0) and (1,0).The unidirectional propagation is further indicated by special directconnect lines 422a, 422b and 422c which propagate carry bits upwardlythrough the Fast Carry portions of VGB's (0,1) and (1,1).

Such unidirectional ripple-through of carry bits may continue across theentire FPGA device so as to allow addition, subtraction or count up/downresults to form in bit aligned fashion along respective columns of theFPGA device. Bit aligned results from a first set of one or more columnscan be submitted to other columns (or even resubmitted to one or morecolumns of the first set) for further bit aligned processing. In oneembodiment, the X CBB generally produces the relatively leastsignificant bit (LSB) of result data within the corresponding VGB, the ZCBB generally produces the relatively next-more significant bit, the WCBB generally produces the relatively next-more significant bit, and theY CBB generally produces the relatively most significant bit (MSB) ofresult data within the corresponding VGB.

In an alternate embodiment, propagation of rippledthrough carry bits maybe zig-zagged first up and then down through successive columns ofVGB's. In such an alternate zig-zagged design, the significance of bitsfor adder/subtractor circuits would depend on whether the bits are beingproduced in an odd or even column of VGB's.

The local feedback lines 435 of each VGB may be used to feedback itsregistered adder outputs to one of the adder inputs and thereby define acounter. The counter outputs can be coupled by way of the adjacent HICto either an intersecting SVIC (e.g., 466, so as to provide addresssequencing) or to an adjacent data port (e.g., 472, 482, so as to storecounter results in the embedded memory at designated time points).

FIGS. 4-7D are provided to facilitate the understanding of the couplingthat is provided by way of the HIC's (e.g., 451 and 452) between theembedded memory blocks (470) and corresponding inputs and outputs of thesuper-VGB's (440) and/or IOB's. It is helpful to study the I/O structureof selected components within each super-VGB and IOB to some extent sothat the data and control input/output interplay between the embeddedmemory columns 114/116 and the SVGB's and the IOB's can be appreciated.At the same time, it is to be understood that the description given herefor the SVGB's and IOB's may be less extensive than that given in theabove-cited Ser. Nos. 08/948,306 and 08/995,615. The description givenhere for the SVGB's and IOB's are intended to provide no more than abasic understanding of the cooperative structuring of the embeddedmemory blocks (470/480) and corresponding inputs and outputs of thesuper-VGB's (440) and IOB's (see FIG. 7A).

Referring to FIG. 6A, each of the X, Z, W, and Y Configurable BuildingBlocks of each VGB has six 19:1, input-terms acquiring multiplexers(shown as a single set with an x6 wide input bus) for acquiring acorresponding six input term signals of the CBB from adjacentinterconnect lines (AIL's). The CBB can process its respectivelyacquired signals in accordance with user-configuration instructions toproduce result signals. The Yz_A signal 548 output by the Y CBB 540 ofFIG. 6A is an example of such a result signal.

Each of the X, Z, W, and Y CBB's further has a result-signal storingregister (e.g., 667 of FIG. 6B) and a 2/4/8xL drive amplifier (e.g., 630of FIG. 6B). A configurable bypass multiplexer (e.g., 668 of FIG. 6B)allows the CBB to be configured to output either a register-storedversion of a CBB result signal or a nonstored (unregistered) resultsignal of the CBB onto adjacent ones of the 2xL lines, 4xL lines and 8xLlines. Various, dynamic control signals may be used by the CBB forcontrolling its internal, result-signal storing register (e.g., 667).These control signals are acquired by way of respective, controls inputmultiplexers (14:1 Ctrl, shown in FIG. 6A) of the respective CBB'sX,Z,W,Y. There are two such controls input multiplexers (14:1 Ctrl)provided for each CBB.

In addition to its 2/4/8xL drive amplifier, each of the X, Z, W, and YCBB's further has a dedicated directconnect (DC) drive amplifier (shownas DC Drive in FIG. 6A and as 610 in FIG. 6B) which can configurablyoutput either a register-stored version of a CBB result signal or annon-stored (unregistered) result signal of the CBB onto adjacent ones ofso-called, direct connect lines. Moreover, each CBB has means foroutputting its registered or unregistered result-signals onto feedbacklines (FBL's 608 and 671) of the VGB. The DCL's (direct connect lines)and FBL's are not immediately pertinent to operation of the embeddedmemory blocks (470) but are mentioned here for better understanding ofnext-described FIG. 4.

FIG. 4 looks at the 2/4/8xL driver output connections for eachsuper-VGB. In FIG. 4, each CBB has four respective output lines fordriving nearby 2xL interconnect lines, 4xL interconnect lines and 8xLinterconnect lines that surround the encompassing super VGB. The fourrespective output lines of each CBB may all come form one internal2/4/8xL line driving amplifier (e.g., 630 of FIG. 6B) or from differentdrive amplifiers.

The layout of FIG. 4 is essentially symmetrical diagonally as well ashorizontally and vertically. The octal length (8xL) lines are positionedin this embodiment further away from the VGB's 401-404 than are the 4xLand 2xL lines of the respective vertical and horizontal interconnectchannels. AIL line 0 of each of the illustrated VIC's and HIC's is atthe outer periphery and AIL numbers run generally from low to high asone moves inwardly. The quad length (4xL) lines are positioned in thisembodiment further away from the VGB's than are the double length (2xL)lines of the respective VIC's and HIC's. It, is within the contemplationof the invention to alternatively position the octal length (8xL) linesclosest to VGB's 401-404, the quad length (4xL) lines next closest, andthe double length (2xL) lines of the respective VIC's and HIC's furthestaway from surrounded VGB's 401-404. The same pattern of course repeatsin each super-VGB of the FPGA core matrix.

VGB_A (401) can couple to same AIL's in the northern octals (Octals(N))as can VGB_D (404) in the southern octals (Octals(S)). A similar,diagonal symmetry relation exists between VGB_B (402) and VGB_C (403).Symmetry for the eastern and western octal connections is indicated byPIP's 431, 432, 433 and 434 moving southwardly along the west side ofthe tile and by counterposed PIP's 441, 442, 443 and 444 movingnorthwardly along the east side.

Note that the non-adjacent 2xL connections of this embodiment (e.g., thePIP connection of the Y CBB in VGB 401 to vertical AIL #40) allow forcoupling of a full nibble of data from any VGB to the 2xL lines ineither or both of the adjacent VIC's and HIC's. Thus, busorientedoperation may be efficiently supported by the L-organized CBB's of eachVGB in either the horizontal or vertical direction. Each CBB of thisembodiment has essentially equivalent access to output result signals toimmediately adjacent 2xL, 4xL and 8xL lines as well as to nonadjacent2xL lines (in the AIL 40-43 sets). Each pair of VGB's of a same row ofcolumn can output 4 independent result signals to a corresponding 4lines in any one of the following 4-line buses, (a) the immediatelyadjacent 2xL0 group (AIL's 16-19), (b) the immediately adjacent 4xLgroup (AIL's 48-51), (c) the immediately adjacent 8xL group (AIL's 0-3),and (d) the not immediately adjacent 2xL1 group (AIL's 40-43).

Aside from having dedicated 2/4/8xL drivers in each CBB, there areshared big drivers (tristateable MaxL drivers) at the center of eachsuper-VGB for driving the MaxL lines of the surrounding horizontal andvertical interconnect channels (HIC's and VIC's). Referring to FIG. 5, ascheme for connecting the shared big drivers (MaxL drivers) to theadjacent MaxL interconnect lines is shown for the case of super-VGB(0,0). This super-VGB (also shown as 101 in FIG. 1) is surrounded byhorizontal interconnect channels (HIC's) 0 and 1 and by verticalinterconnect channels (VIC's) 0 and 1. The encompassed VGB's areenumerated as A=(0,O), B=(0,1), C=(1,0) and D=(1,1). A shared big logicportion of the SVGB is shown at 580. Shared big logic portion 580receives input/control signals 501, 502, 503, 504 and responsively sendscorresponding data and control signals to sixteen, three-state(tristate) longline driving amplifiers that are distributedsymmetrically relative to the north, east, south and west sides of theSVGB. The sixteen, tristate drivers are respectfully denoted as: N1through N4, E1 through E4, S1 through S4, and W1 through W4. Angled line501 represents the supplying of generically-identified signals: DyOE,Yz, Wz, Xz, Zz, FTY(1,2) and FTX(1,2) to block 580 from VGB_A. DyOE is adynamic output enable control. Yz, Wz, Xz; Zz are respective resultsignals from the Y, W, X, Z CBB's of VGB_A. FTY(1,2) and FTX(1,2) arefeedthrough signals passed respectively through the Y and X CBB's ofVGB_A. Angled lines 502, 503 and 504 similarly and respectivelyrepresent the supplying of the above generically-identified signals toblock 580 respectively from VGB_B, VGB_C and VGB_D.

Note that the tristate (3-state) nature of the shared big drivers meansthat signals may be output in time multiplexed fashion onto the MaxLlines at respective time slots from respective, bus-mastering ones ofthe SVGB's along a given interconnect channel.

The adjacent MaxL interconnect lines are subdivided in each HIC or VICinto four groups of 4 MaxL lines each. These groups are respectivelynamed MaxL0, MaxL1, MaxL2 and MaxL3 as one moves radially out from thecore of the super-VGB. MaxL drivers N1 through N4 respectively connectto the closest to the core, lines of respective groups MaxL0, MaxL1,MaxL2 and MaxL3 of the adjacent north HIC.

MaxL drivers E1 through E4 similarly and respectively connect to theclosest to the core ones of MaxL lines in respective groups MaxL0-MaxL3of the adjacent east VIC. MaxL drivers S1 through S4 similarly andrespectively connect to the closest to the core ones of MaxL lines inrespective groups MaxL0-MaxL3 of the adjacent south HIC. MaxL drivers W1through W4 similarly and respectively connect to the closest to the coreones of MaxL lines in respective groups MaxL0-MaxL3 of the adjacent westvertical interconnect channel (VIC(0)).

As one steps right to a next super-VGB (not shown), the N1-N4connections move up by one line in each of the respective groupsMaxL0-MaxL3, until the top most line is reached in each group, and thenthe connections wrap around to the bottom most line for the nextsuper-VGB to the right and the scheme repeats.

A similarly changing pattern applies for the southern drives. As onesteps right to a next super-VGB (not shown), the S1-S4 connections movedown by one line in each of the respective groups MaxL0-MaxL3, until thebottom most line is reached in each group, and then the connections wraparound to the top most line for the next super-VGB to the right and thescheme repeats.

A similarly changing pattern applies for the eastern and western drives.As one steps down to a next super-VGB (not shown), the E1-E4 and W1-W4connections move outwardly by one line in each of the respective groupsMaxL0-MaxL3, until the outer most line is reached in each group, andthen the connections wrap around to the inner most line of each groupfor the next super-VGB down and the scheme repeats. Thus, on each MaxLline, there are multiple tristate drivers that can inject a signal intothat given MaxL line.

The group of MaxL lines in each channel that are driven by tristatedrivers of FIG. 5 are referred to herein as the ‘TOP’ set. This TOP setcomprises AIL's #8, #24, #32 and #12 of respective groups MaxL0, MaxL1,MaxL2 and MaxL3. (The designation of this set as being TOP is arbitraryand coincides with the label TOP in the right bottom corner of FIG. 5 asapplied to the bottom MaxL0 group.)

In similar fashion, the group of MaxL lines in each channel that aredriven by tristate drivers of the next to the right SVGB are referred toherein as the ‘2ND’ set. This 2ND set comprises AIL's #9, #25, #33 and#13. The group of MaxL lines in each channel that are driven by tristatedrivers of the twice over to the right SVGB are referred to herein asthe ‘3RD’ set. This 3RD set comprises AIL's #10, #26, #34 and #14. Thegroup of MaxL lines in each channel that are driven by tristate driversof the thrice over to the right SVGB are referred to herein as the ‘BOT’set. This BOT set comprises AIL's #11, #27, #35 and #15.

FIG. 7A illustrates how IOB's interface with the MaxL lines, and inparticular the TOP set of AIL's #8, #24, #32 and #12; and the 3RD set ofAIL's #10, #26, #34 and #14.

Internal details of each IOB are not germane to the immediate discussionand are thus not fully shown in FIG. 7A. However, as shown in FIG. 7A,each IOB such as IOB_LO (at the top, left) includes two longline drivingtristate drivers 790 and 791 for driving a respective pair of MaxLlines. The illustrated tristate drivers 790 and 791 for example,respectively drive TOP AIL #8 and 2ND AIL #9. Input signals of therespective two longline driving tristate drivers, 790 and 791, may beconfigurably derived from a number of sources including external I/O pin792 of the corresponding FPGA device (e.g., 100 of FIG. 1). Othersources include one or both of two bypassable and serially-coupledregisters within each IOB as will be seen in FIG. 7B.

Each IOB of FIG. 7A, such as IOB_LO; further includes a pin-drivingtristate driver (with configurably-variable slew rate) such as shown at794. Input signals of the pin-driving tristate driver 794 may beconfigurably derived from a number of sources including fromuser-configurable multiplexer 795. Two of the selectable inputs ofmultiplexer 795 are coupled to the same two longlines driven by thatsame IOB. In the case of IOB_LO for example, that would be TOP AIL #8and 2ND AIL #9.

The remaining IOB's shown in FIG. 7A have similar internal structures.As seen, at the left side of the FPGA device, between even-numberedHIC(0) and oddnumbered HIC(1), there are provided six IOB's respectivelyidentified as IOB_LO through IOB_L5. At the right side of the FPGAdevice there are further provided six more IOB's respectively identifiedas IOB_RO through IOB_R5. The external I/O pins are similarly identifiedas PIN_RO through PIN_R5 on the right side and as PIN_LO through PIN_L5on the left side. The same connection pattern repeats between everysuccessive set of even and odd-numbered HIC's. FIG. 7A may be rotatedninety degrees to thereby illustrate the IOB-to-MaxL lines connectivitypattern for the VIC's as well. (References to horizontal lines will ofcourse be changed to vertical and references to left and right IOB'swill of course be changed to top and bottom.)

On the left side, IOB_L0, IOB_L1 and IOB_L2 collectively providebidirectional coupling at least to 3 TOP longlines (AIL's #8, #24, #32)and 1 3RD longline (AIL #14) in the adjacent even-numbered HIC(0). Onthe right side, IOB_R0, IOB_R1 and IOB_R2 collectively providebidirectional coupling at least to 3 3RD longlines (AIL's #10, #26, #34)and 1 TOP longline (AIL #12) in the adjacent and same even-numberedHIC(0). The combination of the six IOB's of HIC(0) therefore allow forbidirectional coupling of nibble-wide data either to the TOP set ((AIL's#8, #24, #32 and #12) and/or to the 3RD set (AIL's #10, #26, #34 and#14).

As seen in the bottom half of FIG. 7A, on the left side, IOB_L5, IOB_L4and IOB_L3 collectively provide bidirectional coupling at least to 3 3RDlonglines (AIL's #10, #26, #34) and 1 TOP longline (AIL #12) in theadjacent odd-numbered HIC(1). On the right side, IOB_R5, IOB_R4 andIOB_R3 collectively provide bidirectional coupling at least to 3 TOPlonglines (AIL's #8, #24, #32) and 1 3RD longline (AIL #14) in the sameodd-numbered HIC(1). The combination of the six IOB's of HIC(1)therefore allow for bidirectional coupling of nibble-wide data either tothe TOP set (AIL's #8, #24, #32 and #12) and/or to the 3RD set (AIL's#10, #26, #34 and #14) of the odd-numbered, adjacent HIC.

In addition to the above-described couplings between the IOB's and theMaxL lines of the interconnect mesh, IOB's also couple by way of directconnect wires to peripheral ones of the SVGB's for both input andoutput. More specifically, there are direct connect wires connecting theleft-side IOB's (IOB_L0 through IOB_LS) to adjacent SVGB's of supercolumn number 0. Two such wires are represented as DC1 and DC2 couplingIOB_L2 to the illustrated column-0 SVGB. FIG. 7A indicates that thesuper column 0 SVGB's can drive the same TOP set of longlines (AIL's #8,#24, #32 and #12) that may be driven by the IOB's, and as will later beseen, by the embedded memory.

There are further direct connect wires connecting the right-side IOB's(IOB_R0 through IOB_R5) to adjacent SVGB's of the rightmost supercolumn. The column number of the rightmost super column is preferably(but not necessarily) equal to an even integer that is not a multiple offour. In other words, it is equal to 4m+2 where m=1, 2, 3, etc. and theleftmost super column is numbered 0. That means there are a total of4m+3 SVGB's per row. The latter implies that square SVGB matrices willbe organized for example as 11×11, 13×13, 19×19, 23×23 SVGB's and so on.(If the same organizations are given in terms of VGB's, they become22×22, 26×26, 38×38, 46×46 VGB's and so on.) The rightmost SVGB number(4m+2) connects by way of direct connect wires to the right-side IOB's.FIG. 7A indicates that these super column number 4m+2 SVGB's can drivethe same 3RD set of longlines (AIL's #10, #26, #34 and #14) that may bedriven by the IOB's, and as will later be seen, by the embedded memory.

In alternate embodiments, the extent of direct connect between IOB's toadjacent columns of SVGB's is increased from extending to just the mostadjacent super column to extending to at least the first two or threenearest super columns. This allows the right-side IOB's to reach theSVGB's that drive the 3RD longline set with direct connections.

Aside from direct connect wires, IOB's may be further coupled to theSVGB's of the device by 2xL, 4xL, 8xL lines of the adjacent HIC's.Coupling between the IOB's and the 2xL, 4xL, 8xL lines of adjacent HIC'smay be provided through a configurable dendrite structure that extendsto the multiplexer 795 of each IOB from pairs of adjacent HIC's. Thespecific structure of such configurable dendrite structures (not shown)is not germane to the present disclosure. It is sufficient to understandthat configurable coupling means are provided for providing couplingbetween the 2xL, 4xL, 8xL of the adjacent HIC's and the correspondingIOB's. A more detailed disclosure of dendrite structures may be found inthe above-cited, US application Ser. No. 08/995,615.

FIG. 7B may now be referred to while keeping in mind the input/outputstructures of the surrounding SVGB's and IOB's as described above forrespective FIGS. 1-5 and 7A. In FIG. 7B, control signals forsynchronizing various I/O flows are shown in combination with elementsthat direct the I/O flows.

However, before describing these more complex structures of the IOB's,it will be beneficial to briefly refer to FIG. 6B and to describe dataflow structures that can direct various dynamic signals to the D (645),clock (663), clock-enable (664), reset (651) and set (652) inputterminals of CSE flip flop 667. It will be beneficial to also brieflydescribe data flow structures that can direct the Q output (669) of theCSE flip flop and/or register-bypassing alternate signals to variousinterconnect lines (2xL lines through MaxL lines).

Referring to 6B, an example is shown of a specific CSE 60Y that may beincluded within each Y CBB of each VGB. CSE 60Y is representative oflike CSE's (Configurable Sequential Elements) that may be included inthe respective others of the X, W and Z CBB's of each VGB. The signalprocessing results of the given CBB (e.g., the Y one) may respectivelyappear on lines 675 and 672 as signals f_(a) (3T) and f_(b)(3T). Here,the notation f_(m)(nT) indicates any Boolean function of up to nindependent input bits as produced by a user-programmable LUT (lookuptable, not shown) identified as LUT m. The output of a synthesized4-input LUT may appear on line 675 as signal f_(Y)(4T). The output of asynthesized 6-input LUT may appear on line 635 as signal f_(D)(6T).Alternatively, line 635 may receive a wide-gated signal denoted asf_(WO)(p) which can represent a limited subset of functions having up top independent input bits. In one embodiment, p is 16. A result signal(SB3) produced by an in-CBB adder/subtractor logic (570 of FIG. 6A)appears on line 638. Configuration memory bits 639 are user-programmableso that multiplexer 640 can be instructed to route the result signal ofa selected one of lines 675, 635 and 638 to its output line 645. Assuch, multiplexer 640 defines an example of a user-programmable,result-signal directing circuit that may be found in each CSE of the VGB500A shown in FIG. 6A. Other result-signal directing circuits may beused as desired.

Each CSE includes at least one data storing flip-flop such as thatillustrated at 667. Flip-flop 667 receives reset (RST) and set controlsignals 651 and 652 in addition to clock signal 663 and clock enablesignal 664. A locally-derived control signal CTL1 is presented at line655 while a VGB common enable is presented on line 654. Multiplexer 604is programmably configurable to select one or the other of lines 654,655 for presentation of the selected input signal onto output line 664.As explained above, lines 672, 675, 635 and 638 carry logic block (CBB)result signals. The control signals of lines 651 through 655 are derivedfrom common controls section 550 of FIG. 6A. The common controls section550 acquires a subset of neighboring signals from AIL's by way of the14:1 Ctrl multiplexers and defines a further subset or derivative ofthese as VGBcommon control signals. The signals of lines 653, 654 and655 may be used to control the timing of when states change at theoutputs of respective line drivers 610 (DCL driver), 620 (to-tristatedriver), 630 (2/8xL driver), 668 (FBL driver) and 670 (FBL driver). Amore detailed explanation of such CBB-result signals may be found in atleast one of the above-cited, copending applications.

With the three bits of configuration memory shown at 639 in FIG. 6B, auser can control multiplexer 640 to select an appropriate data signal645 for supply to the D input of flip-flop 667. The selected signal maybypass the flipflop by routing through a user-programmable multiplexer668 to line 608. Multiplexer 668 may be programmed to alternativelyapply the Q output of flip-flop 667 to line 608. Buffer 610 drives adirect-connect line 612. Buffer 630 drives one or more of CBB-adjacent2xL, 4xL or 8xL lines. Connection 636 is to a non-adjacent 2xL line (seeFIG. 4). Items 632, 633, 634 and 638′ represent PIP-like, programmableconnections for progra mably interconnecting their respective co-linearlines. A more detailed explanation of the CSE structure and its othercomponents may be found in at least one of the above-cited, copendingapplications. For purposes of the present application, it is to beunderstood that elements 620, 670, 632, 634, 638′ and 633 defineexamples of user-programmable, stored-signal directing circuits that maybe found in each CSE of the VGB 500A shown in FIG. 6A and may be usedfor directing the Q output of flip flop 667 to one or more interconnectresources such adjacent 2xL-8xL lines or MaxL lines. Other stored-signaldirecting circuits may be used as desired.

Referring to the IOB structure 700 shown in FIG. 7B, this IOB 700 may beused to provide a configurable interconnection between the input/outputpin/pad 709 and neighboring, internal interconnect resources. Thechip-internal interconnect resources may supply signals for output byIOB 700 to external circuits, where the external circuits (not shown)connect to I/O pin or pad 709. In particular, the internal interconnectresources that can supply such signals to an IOB first multiplexer 710include a first plurality 711 of 8 direct connect lines (DCL's), asecond plurality 712 of 6 MaxL lines, and a third plurality 713 of 6dendrite lines (Dend's). The signal selected for output on line 715 ofthe multiplexer may be transmitted by way of register-bypass multiplexer725 and pad-driving amplifier 730 for output through I/O pin/pad 709.

External signals may also be brought in by way of I/O pin/pad 709 fortransfer by the IOB 700 to one or more of a fourth plurality 714a,b oftwo MaxL lines, and to one dendrite line 715, and NOR line 716, and onedirect connect line 717. Lines 714a and 714b are each connected to arespective MaxL line. Line 716 operates in open-collector mode such thatit can be resistively urged to a normally-high state and can be pulledlow by one or more open-collector drivers such as driver 766. Theillustrated INPUT_ENd line couples to a gate of one of plural, in seriespull-down MOSFET transistors (not shown) in 766 that can sink currentfrom the NOR line 716.

IOB 700 includes a first register/latch 720 for storing a respectivefirst output signal. This first output signal is supplied to a D inputof unit 720 by line 715. A plurality 719 of 20 configuration memorycells determines which interconnect resource will supply the signal toline 715. In an alternate embodiment, a combination (not shown) of adecoder and a fewer number of configuration memory cells may be used toselect a signal on one of lines 711-713 for output on line 715.

IOB 700 includes a second register/latch 750 for storing an input signalsupplied to a D input thereof by a dynamic multiplexer 745. Inputsignals may flow from pad 709, through input buffer 740, throughuser-programmable delay 742 and/or through delay-bypass multiplexer 744to one input terminal of dynamic multiplexer 745. A second inputterminal of dynamic multiplexer 745 couples to the Q output of thesecond register/latch 750. The selection made by multiplexer 745 isdynamically controlled by an IOB INPUT_CLKEN signal supplied on line746.

A plurality of control signals may be input to IOB 700 for controllingits internal operations. These include input enable signals, INPUT_ENa,INPUT_ENb, INPUT_ENc, and INPUT_ENd. Input enable signals, INPUT_ENa,INPUT_ENb, and INPUT_ENC respectively drive the output enable terminalsof respective tristate drivers 761, 762 and 765. The INPUT_ENd signalselectively enables the pull-down function of open-collector(open-drain) driver 766 as explained above. A respective plurality offour deactivating multiplexers 771, 772, 775 and one more (not shown)for 766 are provided for user-programmable deactivation of one or moreof the respective tristate drivers 761, 762 and 765, and of driver 766.In one embodiment, all of input enable signals, INPUT_ENa, INPUT_ENb,INPUT_ENc, and INPUT_ENd are tied together and designated simply as acommon INPUT_EN signal. In an alternate embodiment, just the INPUT_ENaand INPUT_ENb enable signals are tied together and designated as acommon and dynamically changeable, INPUT_EN signal while each of theINPUT_ENc and INPUT_ENd lines are tied to Vcc (set to logic ‘1’).

Further control signals that may be supplied to IOB 700 include an INPUTCLOCK signal (INPUT_CLK) on line 747, the INPUT_CLKEN signal on line746, an OUTPUT_EN signal that couples to the QE terminal 732 of tristatedriver 730, an OUTPUT_CLOCK signal on line 727, an OUTPUT_CLKEN signalon line 726, and a COMMON SET/RST signal on lines 705 and 705′. Thesecontrol signals may be acquired from adjacent interconnect lines by oneor more IOB control multiplexers such as the one illustrated in FIG. 7C.

As illustrated in FIG. 7B, programmable memory bits in the FPGAconfiguration memory may be used to control static multiplexers such as728, 748, etc. to provide programmable polarity selection and otherrespective functions. Static single-pole double-throw electronicswitches 706 and 708 are further controlled by respective configurationmemory bits (m) so that the COMMON SET/RST signal of lines 705, 705′ canbe used to simultaneously reset both of register/latches 720 and 750, orsimultaneously set both of them, or set one while resetting the other.

An output of register by-pass multiplexer 725 is coupled to pad drivingamplifier 730. The amplifier 730 is controllable by a user-programmable,slew rate control circuit 735. The slew rate control circuit 735 allowsthe output of pad driving amplifier 730 to either have a predefined,relatively fast or comparatively slow rise time subject to the state ofthe memory bit (m) controlling that function. The OUTPUT_EN signalsupplied to terminal 732 of the pad driving amplifier 730 may be usedswitch the output of amplifier 730 into a high-impedance state so thatother tristate drivers (external to the FPGA chip) can drive pad 709without contention from driver 730.

External signals may be input to IOB 700 as explained above via pin 709and input buffer 740. In one embodiment, the user-programmable delayelement 742 comprises a chain of inverters each having pull-downtransistors with relatively large channel lengths as compared to logicinverters of the same chip. The longer channel lengths provide a higherresistance for current sinking and thus increase the RC response time ofthe inverter. A plurality of user-programmable, internal multiplexers(not shown) of delay unit 742 define the number of inverters that adelayed signal passes through. The user-programmable delay element 742may be used to delay incoming signals for the purpose of deskewing datasignals or providing a near-zero hold time for register/latch 750. Aglobal clock signal (GK) of the FPGA array may be used for example as asource for the INPUT_CLOCK signal of line 746. Due to clock skew, theglobal clock signal may not reach register/latch 750 before a datasignal is provided to the D input of register/latch 750. In such asituation, the variable delay function of element 742 may be used todelay incoming data signals acquired by buffer 740 so they can alignmore closely with clock edges provided on clock input terminal 749 ofregister 742.

Each of configurable input register/latches 720 and 750 can beconfigured to operate either as a latch or as a register, in response toa respective memory bit setting (721, 751) in the configuration memory.When the respective register/latch (720 or 740) operates as a register,data at its D input terminal is captured for storage and transferred tothe its Q output terminal on the rising edge of the register's CLOCKsignal (729 or 749). When the register/latch operates as a latch, anydata change at D is captured and seen at Q while the signal on thecorresponding CLOCK line (729 or 749) is at logic ‘1’ (high). When thesignal on the CLOCK line returns to the logic ‘0’ state (e.g., low), theoutput state of Q is frozen in the present state, and any further changeon D will not affect the condition of Q while CLOCK remains at logic‘0’.

A COMMON SET/RST signal may be generated from a VGB to all IOBs or to asubset of IOBs in order to set or reset the respective latches (720,750) in the affected IOB's. The COMMON SET/RST signal may also begenerated by peripheral device that is coupled to the FPGA array by wayof a particular IOB.

The Q output of register/latch 750 couples to respective first inputterminals of a plurality of user-programmable, register-bypassingmultiplexers 755 and 757. Multiplexer 757 drives direct connectamplifier 760 while multiplexer 755 drives amplifiers 761, 762, 765 and766. Respective second input terminals of register-bypassingmultiplexers 755 and 757 receive a register-bypassing signal from theoutput of delay-enabling multiplexer 744.

Referring to briefly back to FIG. 7A, for one subspecies of thisembodiment, element 790 and 791 respectively correspond to elements 761and 762 of FIG. 7B while element 794 corresponds to element 730 andelement 795 corresponds to element 710. While the specific embodiment ofFIG. 7B uses plural flip flops respectively for storing input and outputsignals, it is also within the contemplation of the invention to use asingle flip flop for at different times storing either an input oroutput signal and for directing respective clock and clock enablecontrol signals to that one flip flop in accordance with its usage atthose different times.

Referring to FIG. 7C, the control signals that are used for a pluralityof neighboring IOB's (which plurality is at least equal to 3 in oneembodiment) may be derived from interconnect channels that extendperpendicular to the array edge on which the corresponding IOB's reside.In the example of FIG. 7C, a plurality of 6 co-controlled IOB's resideon a left edge and are neighbored by an immediately above or upper HICand by an immediately below or lower HIC. The 6 co-controlled IOB's aredivided into two nonoverlapping subsets of 3 immediately adjacent IOB's.Each subset of 3 immediately adjacent IOB's has its own ‘common’ controlsignals which are shown above dashed line 781 and ‘individual’ controlswhich are shown below dashed line 781. For each such subset of 3immediately adjacent IOB's there is a first stage multiplexer (notshown) which selects whether the immediately upper or immediately lowerchannel will supply the control signals. The successive second stagemultiplexer is illustrated as 780 in FIG. 7C. This second stagemultiplexer 780 determines which specific signals from the electedchannel will be used.

The illustrated, ‘left side’, IOB control multiplexer 780 comprises aplurality of eleven multiplexer input lines designated as MILs #1-11. Apartially-populating set of PIP's is distributed as shown over thecrosspoints of MILs #1-11 and illustrated lines of the elected HIC(upper or lower) for transferring a signal from a desired HIC line tothe respective MIL line. Each AIL has 8 PIP's along it for theembodiment of FIG. 7C while each MIL also has 8 PIP's along it. Thisallows for symmetric loading of lines.

MIL #1 for example, may be used to transfer to multiplexer 748 a controlsignal from AIL numbers 15, 39, 42 and 52 of the upper HIC when theupper HIC is elected or from AIL numbers 17, 41, 44 and 49 of the lowerHIC when the lower HIC is elected. The other four PIP's of MIL #1 arecoupled to the four global clock lines, CLK0-CLK3 of the FPGA array.Polarity-selecting multiplexer 748 is essentially the same as that shownin FIG. 7A except that for embodiments that follow FIG. 7C, clock line749′ connects directly to the clock inputs of each correspondingregister 750 of the 3 IOB's in the controls-sharing group.

Similarly, for MIL #3, polarity-selecting multiplexer 728 is essentiallythe same as that shown in FIG. 7A except that for embodiments thatfollow FIG. 7C, clock line 729′ connects directly to the clock inputs ofeach corresponding register 720 of the 3 IOB's in the controls-sharinggroup.

MIL #5 can provide a local set or reset signal which is logically ORredin OR gate 788 with the FPGA array's global SET/RST signal. Output 785′of the OR gate connects directly to the common SET/RST lines 705, 705′of each corresponding IOB in the controls-sharing group of IOB's. If alocal set or reset signal is not being used, MIL #5 should beprogrammably coupled to ground by the PIP crossing with the GND line.

MIL #6, 7, and 8 may be used to define individual IOB control signalsOUTPUT ENO, OUTPUT ENI, OUTPUT EN2 respectively to the OUTPUT ENterminal of each of a first, second, third IOB of the control-sharinggroup. MILs #9, 10, 11 may be used to define individual IOB controlsignals INPUT EN0, INPUT EN1, INPUT EN2 respectively to the INPUT ENterminal of each of the first, second, and third IOB of thecontrol-sharing group. Other means are of course possible for acquiringa subset of signals from the AIL's of each IOB and defining therefromthe control signals of the IOB. The connection between these aspects ofthe IOB's and the control signals that are used for controlling theembedded memory blocks of the same FPGA array will become apparentbelow.

Referring now to FIG. 8, a right memory channel (RMC) is broadly shownat 816. The RMC 816 includes a special vertical interconnect channel(SVIC) as shown under the braces of 860 and a memory block as shown at870.

A horizontal interconnect channel (HIC) that belongs to the generalinterconnect of the FPGA array is shown passing through at 850. Darkenedsquares such as at 855 are used to indicate general areas of possibleinterconnection (e.g., PIP connections) to various portions of thepassing-through HIC. Memory I/O multiplexer area 878 (first dashed box)corresponds to area 478 of FIG. 3. Memory control multiplexer area 877(second dashed box) corresponds to area 477 of FIG. 3. Memory controlacquisition area 871 (third dashed box) corresponds to symbol 471 ofFIG. 3.

Memory block 870 contains a multi-ported SRAM array organized as 32-by-4bits (for a total of 128 bits). One of the ports is of a read-only typeas indicated at 882. Another port is bidirectional and provides for bothreading of nibble-wide data out of memory block 870 and for writing ofnibble-wide data into memory block 870 as indicated at 884. Outputenable terminal 883 cooperates with the read/write data port 884, aswill be explained shortly. For sake of convenience, the read/write port884 is also be referred to herein as the first port, or Port_1. Theread-only data port 882 is referred to as the second port, or Port_2.

Two different address signals may be simultaneously applied to memoryblock 870 for respectively defining the target nibble (4 data bits) thatare to pass through each of first and second data ports, 884 and 882. Assuch, a 5-bit wide first address-receiving port 874 is provided in block870 for receiving address signals for the read/write data port 884(Port_1). A second 5-bit wide address-input port 872 is provided forreceiving independent address signals for association with the read-onlydata port 882 (Port_2). Additionally, a 6-bit wide controls-input port873 is provided in block 870 for receiving various control signals fromthe adjacent SVIC 860 as will be detailed shortly. The respectivecombination of 5, 6, and 5 (address, control, address) lines adds up toa total of 16 such lines.

SVIC 860 contains a diversified set of special-function interconnectlines. A first set of four longlines are dedicated to carrying theCLK0-CLK3 clock signals of the FPGA array. This set of four clock linesis denoted as SCLK bus 861.

Another set of sixteen longlines is illustrated at 862 and identified asspecial maximum length lines (SMaxL). Like the other longlines ofintegrated circuit 100, the SMaxL lines 862 extend continuously andfully over a corresponding working dimension of the FPGA matrix. TheSMaxL lines 862 are subdivided into respective groups of 5, 6 and 5lines each as denoted by identifiers 862a, 862c and 862b. Configurableinterconnections of these respective components 862a-c with crossingbuses 872-874 are denoted by darkened squares such as at 865. It is seenfrom the darkened square icons of FIG. 8 that either of the 5-bit widelongline components 862a or 862b can supply a 5-bit wide address signalto either one or both of address-input ports 874 and 872. Similarly, the6-bit wide vertical longline component 862c may be used for supplyingall six of the control signals supplied to 6-bit wide port 873.

SVIC 860 further includes two sets of special, quad-length linesrespectively denoted as S4×L0 and S4×L1. These sets of quad-lines arerespectively illustrated at 864 and 866 as being each sixteen lineswide. In each set of quad lines, the set is further subdivided intorespective components of five, six and five lines (5/6/5) in the samemanner that wires-group 862 was. Again, darkened squares are used toindicate the provision of configurable interconnections to therespective ports 872, 873 and 874 of memory block 870. Unlike thestaggered organization of the general quad-length lines (4×L lines)shown in FIG. 2, in one embodiment of the FPGA device 100 the special,quad-length lines in the two sets, S4×L0 (864) and S4×L1 (866) are notstaggered and are not joined one to the next by switch boxes. Thisnon-staggered organization allows for simultaneous broadcast to a groupof as many as 4 adjacent SRAM blocks (4×4×32 bits of memory) of fivebits of address signals for each respective address port (874, 872)and/or six bits of control signals for each respective control port(873). Omission of switch boxes in the two special quad-length sets,S4×L0 (864) and S4×L1 (866), helps to reduce capacitive loading andthereby helps to speed the transmission of address and/or controlsignals to ports 872, 873, 874 by way of S4×L0 (864) and S4×L1 (866).

Memory control acquisition area 871 (dashed box) is defined by thedarkened square connections of SVIC 860 to ports 872, 873, 874 of block870. The memory control acquisition area 871 may be configured by theFPGA user such that the five bits of the read-only address input port872 may be acquired from the five-bit wide components of any one of linesets 862, 864 and 866. Similarly, the five-bit address signal of theread/write input port 874 may be acquired from any one of these verticalline subsets. The six control signals of input controls port 873 may beacquired partially from the SCLK bus 861 and/or fully from any one ofthe six-bit wide components of vertical line sets 862, 864 and 866.

FPGA-wide address or control signals that are common to a given embeddedmemory column 114/116 may be broadcast as such over longlines such asthat of SVIC components 861 and 862. More localized address or controlsignals that are common to a given section of an embedded memory column114/116 may be broadcast as such over S4×L components 864 and 866 of theSVIC.

HIC 850 crosses with SVIC 860 in the region of memory controlmultiplexer area 877. As seen in FIG. 8, HIC 850 also has a set ofsubcomponents. More specifically, there are sixteen longlines denoted at859 as the MaxL set. There are four octal-length lines denoted at 858 asthe 8×L set. There are four quad-length lines denoted at 854 as the 4×Lset. There are eight double-length lines denoted at 852 as the 2×L set.Furthermore, there are sixteen direct-connect lines denoted at 851 asthe DCL set. Moreover, there are eight feedback lines denoted at 857 asthe FBL set. Nibble-wide data transmission is facilitated by thepresentation of each of these diversified interconnect resources (851,852, 854, 857-859) as a number of wires, where the number is an integermultiple of 4.

Within the dashed box of FIG. 8 that is designated as memory I/Omultiplexer area 878, darkened sources are provided to show the generalinterconnections that may be formed (in accordance with one embodiment)between HIC 850 and the buses extending from ports 882, 883 and 884 ofthe memory block 870. As seen, in this embodiment, the read/write dataport 884 (Port_1) is restricted to configurable connections only withthe MaxL set 859. This restriction allows for run-time switching betweenread and write modes. It should be recalled from FIGS. 7A-7B that thelonglines of the MaxL set 859 can be driven by tristate drivers of theadjacent SVGB's and/or IOB's. As will be seen in FIG. 9, the read/writedata port 884 (Port_1) also has tristate drive capability. Data can thusbe output onto the tristateable MaxL set 859 by a given bus master (SVGBor IOB) that wants to write data into the read/write data port 884(Port_1) or output onto the tristateable MaxL set 859 by Port_1 itselfwhen Port_1 (884) is in a read mode.

The read-only data port 882 (Port_2) can output data signals, inaccordance with the illustrated interconnect possibilities, to any oneor more of the MaxL set 859, the 8×L set 858, the 4×L set 854 and the2×L set 852.

Output enable signals may be acquired by port 883 in accordance with theillustrated interconnect possibilities, from one of sets 859, 858, 854and 852.

It is within the contemplation of the invention to have other patternsof interconnect coupling possibilities in multiplexer area 878. However,for one embodiment of SRAM block 870, the particular intercouplingpossibilities shown in 878 is preferred for the following reasons. Theread-only data port 882 (Port_2) tends to output read data at a fasterrate than does the read/write data port 884 (Port_1). As such, it isparticularly useful to be able to output this more-quickly accessed data(from Port_2) by way of the shorter-length (and thus faster) 2×L lines852. A user-configurable multiplexer coupling is therefore provided fromthe read-only data port 882 to the 2×L lines set 852. Additionaluser-configurable multiplexer couplings are further provided to linesets 854, 858 and 859.

The writing of data into port 884 or the reading of data from port 884tends to be a relatively slower process as compared to the reading ofdata from port 882. At the same time, it is desirable to be able tosource data into port 884 from any column of the FPGA device 100(FIG. 1) and/or from any column of IOB's (1-24, 49-72).User-configurable multiplexer connections 855 are therefore provided forbi-directional and tristateable transfer of data between the read/writedata port 884 and the MaxL lines set 859. However, it is not desirableto have further user-configurable interconnections between read/writedata port 884 and the other, not-tristateable line sets 858, 854, 852,851 and 857 of HIC 850. Converting the other line sets 858, 854, 852,851 and 857 of HIC 850 into tristateable lines would consume additionalspace in the integrated circuit 100 because the 2/4/8×L outputs (FIG. 4)of the CBB's would have to be converted into tristate drivers for thisone purpose without providing substantial improvement in speed andperformance. As such, in a preferred embodiment, the read/write dataport 884 (Port_1) is couplable only to the adjacent MaxL lines set 859.

It will be seen later (in the embodiment of FIG. 9), that the OE port883 may be used to time the outputting of time-multiplexed data fromport 884. The output data may be pre-stored in a Port_1 read-register(not shown in FIG. 8). As such, high-speed coupling of control signalsto port 883 may be desirable even if the Port_1 data portion 884 couplesonly to longlines 859. Data may be time-multiplexed onto longlines 859at relatively high switching speed by using the high-speed enablingfunction of the OE port 883. Accordingly, as seen in FIG. 8,user-configurable multiplexer options are provided for coupling controlsignals to OE port 883 from the shorter (faster) line sets 852, 854 and858 as well as from longer line set 859.

FIG. 9 shows a next level of details within an SRAM block such as 870 ofFIG. 8. The internal structure of such an SRAM block is generallydesignated as 900 and includes a shared SRAM array 901. Repeated,dual-port memory cells are provided within array 901. Each suchdual-port memory cell is referenced as 902.

In one embodiment of FPGA device 100 (FIG. 1), there are 128 dual-portedmemory cells 902 within SRAM array 901. The data of these cells 902 maybe simultaneously accessed by way of respective, bidirectional couplings903 and 904. Couplings 903 and 904 carry both address and data signalsfor the correspondingly accessed cells.

A first configuration memory bit 905 of the FPGA device 100 is dedicatedto a respective SRAM block 900 for allowing users to disabletransition-sensitive inputs of block 900 in cases where block 900 is notbeing used. A logic ‘0’ is stored in configuration memory bit 905 whenblock 900 is not used. A logic ‘1’ signal in configuration memory bit905 becomes an active RAM enabling signal 906 (RAMEN) that permits block900 to be used.

A first port control unit 910 (Port_1 Unit) is provided for controllingoperations of the read/write data port 884 and its corresponding addressinput port 874.

The supplied five-bit address signal 874 for Port_1 may be stored withina first address-holding register 911 of block 900 and/or it may betransmitted through bypass path 912 to a first data input of addressmultiplexer 914. A second data input of multiplexer 914 receives the Qoutput of the first address-storing register 911. Configuration memorybit 915 controls multiplexer 914 to select as the current address signal(A_(1in)) of Port_1, either the signal present at the first input (912)or at the second input (Q) of address-selecting multiplexer 914. Theselected address signal 918 is then applied to the address input A_(1in)of the Port_1 unit 910.

An address-strobing signal 958 may be applied to a clock input ofaddress-storing register 911 for causing register 911 to latch onto thesignal presented on line 874. The address-strobing signal 958 isproduced by passing a rising edge of an address-validating clock signal(ADRCLK) through control-input terminal 933 and through anaddress-strobe enabling AND gate 908. The second input of AND gate 908is connected to the RAMEN signal 906 so that the output of gate 908 ispulled low (to logic ‘0’) when RAMEN is at logic ‘0’.

In addition to address-input port 918, the Port_1 unit 910 has aD_(1out) port (971) from which data may be read out and a D_(1in) port(977) into which data may be written Port_1 unit 910 further includes awrite-enable terminal 978 (WE1) onto which a logic ‘1’ signal must beplaced in order to move write data from the D_(1in) port 977 into SRAMarray 901 by way of coupling 903. Unit 910 further has a read-enableterminal 979 (RE1) onto which a logic ‘1’ signal must be placed in orderto move read data from array 901 to the D_(1out) port 971 by way ofcoupling 903.

The D_(1out) port 971 is 4-bits wide and is coupled to the D input portof a 4-bit wide, read-register 972. The Q output of register 972 couplesto one selectable input of a synch controlling multiplexer 973. TheD_(1out) port 971 additionally couples to a second 4-bit wide selectableinput of multiplexer 973. An RS/A control signal (Read Synch or Asynchcontrol) is applied to the selection control terminal of the synchcontrolling multiplexer 973 for selecting one of its inputs as a signalto be output to tri-state output driver 974. The RS/A signal comes froma control output 953 of an R/W control unit 950. Another output terminal952 of the R/W control unit produces the WE1 signal which couples toterminal 978. Yet another output terminal 951 produces the RE1 signalwhich couples to terminal 979.

The output enabling terminal of tri-state driver 974 is coupled tooutput 943 of a Port_1 read-enabling AND gate 941. AND gate 941 includesthree input terminals respectively coupled to receive the RAMEN signal906, the OE signal from line 883, and an R/WEN signal as provided online 934.

Line 934 (R/WEN) is one of the six lines that form control port 873(FIG. 8). The other five lines are respectively 931 for receiving anRWCLK (read/write clock) signal, 932 for receiving the already-mentionedADRCLK signal, 935 for receiving an RMODE signal, and 936 for receivingan ROEN (read-only enable) signal.

The RWCLK (read/write clock) signal on line 931 passes through AND gate907 when RAMEN is true to provide access-enabling strobes on line 917for Port_1. Line 917 couples to a rising-edge sensitive, clock input ofthe read register 972 of Port_1. Register 972 acquires the D_(1out)signal at its D input for storage upon the rising edge of each pulsepresented on line 917.

The Port_1 access-enabling line 917 also connects to a rising-edgesensitive, clock input of a write-data storing register 976. Register976 receives four bits of write-data at its D input port from writebuffer (high input impedance amplifier) 975. The input of buffer 975connects to the 4-bit wide read/write data port 884. The output (Q) ofregister 976 couples to the 4-bit wide D_(1in) input of the Port_1 unit910.

It is seen, therefore, that acquisition of memory write data throughport 884 occurs in synchronism with the RWCLK signal 931. For writing tooccur, an active write-enable signal WEN must further be applied toterminal 954 of the read/write control unit 950. WEN 954 is the binaryinverse of the R/WEN signal on control line 934. The combination ofR/WEN control line 934 and OE control line 883 is provided so that theread/write port (Port_1) may have at least three separate states,namely, high-impedance output (Hi-Z), active bistable output (reading),and data inputting (writing).

In an alternate embodiment, the dashed, alternate connection and dashedline cut indicated by 947 is made and the responsiveness of registers911 and 972 is modified such that one of these registers (e.g., 911)latches on the rising edge of passed-through RWCLK pulses and the otherof these registers (e.g., 972) latches on the opposed falling edge ofpassed-through RWCLK pulses. The pulse width of the passed-through RWCLKpulses (917) would be adjusted in such an alternate embodiment to be atleast equal to or greater than the address-strobe to read-valid latencyof Port_1. Register 976 may latch on either edge of the passed-throughRWCLK pulses (917). If write-register 976 is made to latch on the pulseedge opposite to that of read-register 972, write and read-backoperations may be carried out in close time proximity to one another.

In yet another alternate embodiment, the dashed, alternate connectionand dashed line cut indicated by 948 is made and the responsiveness ofregister 921 is modified such that register 921 latches on apredetermined one of the rising and falling edges of passed-throughROCLK pulses (927). If both of modifications 947 and 948 are made, thenthe ADRCLK control signal 933 and its associated hardware (e.g., 908 ofFIG. 9) may be eliminated to thereby provide a more compact device.

In yet another alternate embodiment, line 933, gate 907 and line 958 arereplicated so as to define two separate, RAMEN-enabled,address-validating strobes where one is dedicated to the address-storingregister 911 and the other is dedicated to the address-storing register921. Such an alternative embodiment is represented in next-described,FIG. 10 by a dashed line denoted as carrying an ADRCLK2 signal.

FIG. 10 provides a view of a combined, monolithic system 1000 inaccordance with the invention which shows both a multi-ported SRAM array1010 and logic circuitry, generally designated as 1020 for supplyingaddress signals to SRAM array 1010.

More specifically, SRAM array 1010 includes a respective first accessport (PORT#1) and a second access port (PORT#2) having respectiveaddress inputs 1013 and 1014. PORT#1 address signals may be received atthe first address input 1013 either from a respective PORT#1address-capturing register 1011 or by way of a programmably-activatableregister-bypass path 1017. PORT#2 address signals may be received at thesecond address input 1014 either from a respective PORT#2address-capturing register 1012 or by way of a programmably-activatableregister-bypass path 1018.

In one embodiment, clock line 1015 supplies address-strobing signalADRCLK1 to the clock inputs of both of registers 1011 and 1012. In analternate embodiment, clock line 1015 supplies the address-strobingsignal ADRCLK1 only to the clock input of first register 1011 while aseparate clock line 1016 supplies an independent address-strobing signalADRCLK2 to the clock input of second register 1012. In the latterembodiment, break 1016a is made. The former embodiment where break 1016ais not made and clock line 1015 services both of registers 1011 and 1012is preferred for cases where it is desirable to minimize consumption ofinterconnect resources.

Tilted-ellipse symbol 1065 represents a user-programmable, selectivecoupling of line 1015 to one of the vertical lines of special verticalinterconnect channel (SVIC) 1060. In one embodiment, SVIC 1060corresponds to 860 of FIG. 8 and 1065 corresponds to acontrols-acquisition coupling made by bus 873 to SVIC 860. If line 1016is used, then dashed symbol 1066 similarly represents auser-programmable, selective coupling of line 1016 to one of thevertical lines of SVIC 1060. If line 1016 is not present and used, theinternal PIP elements (not shown) of symbol 1066 are similarly notpresent and used.

SVIC 1060 can supply the ADRCLK1 address-strobing signal to selectionelement 1065 from a plurality of source points located along SVIC 1060.Tilted-ellipse symbol 1067 is representative of such user-identified anduser-programmable, source points. In one embodiment, element 1067corresponds to a controls-transfer coupling such as would be made inFIG. 8 within the Mem Ct1 Mux Control Area 877, wherein control signalsare selectively transferred from a given HIC 850 to SVIC 860. Line 1057is representative of a HIC line that transmits a respective ADRCLK0signal to control-transfer coupling 1067. When picked up atcontrol-acquisition coupling 1065 and transferred onto line 1015, thesignal is renamed as ADRCLK1. When picked up at yet anothercontrol-acquisition coupling 1063 and transferred onto a correspondingHIC line of a general routing path identified as (H/V)IC 1001, thesignal is renamed as ADRCLK3. The ADRCLK3 control-acquisition coupling1062 can overlap with the ADRCLK0 control-transfer coupling 1067 or itcan be located elsewhere along SVIC 1060. FPGA configuration by the usercan create either scenario. In one variation, line 1057 is a globalclock line (CLK0-CLK3) that extends throughout the FPGA array forselective acquisition by generally all CBB's and IOB's and which furtherextend into each SVIC 1060 (see 861 of FIG. 8) for selective acquisitionby generally all SRAM blocks of that SVIC. Under this one variation,line 1057 effectively merges with lines 1015 and 1001 whilecontrol-transfer coupling 1067 effectively merges with 1065 and 1063.

The ADRCLK0 signal on HIC line 1057 originates from one or more ADRCLKsourcing circuits 1055. These ADRCLK sourcing circuits 1055 can be inthe form of VGB's or IOB's and can link to HIC line 1057 either directlyor by way of VGB-implemented, dynamic multiplexers (whose creation isdescribed in at least one of the above-cited and incorporated, U.S.applications) and/or general interconnect. In the case where independentcontrol-acquisition coupling 1066 is present with optional line 1016,control-transfer coupling 1067 may be seen as providing the respectiveADRCLK source signals from a bus designated as 1057 instead of a singleline 1057. In the same case, ADRCLK sourcing circuits 1055 would providethe one or more signals that eventually become ADRCLK1 and ADRCLK2.

Referring to the time versus signal amplitude plot at 1005 in FIG. 10,one or both of the rising edge 1006 and falling edge 1008 of aregister-strobing pulse may be used to latch onto data presented at theD input of the register so that the same can be stored in the registerand maintained at the Q output of the register until a nextregister-strobing event. The register may alternatively operate in a‘latch mode’ where the Q output of the register can change while theclock pulse is at the high level 1007. The present disclosurecontemplates the use of any combinations of these possibilities,including having registers that are either user-programmable or fixed tooperate in one or more of the latch mode, the single-edge responsivemode (rising or falling) and the dual-edge responsive mode (where Qchanges on each of rising and falling edges). For purpose of simplicity,each event that causes a register to store and maintain a given outputstate is referred to herein as a register-strobing event.

Accordingly, when one of ADRCLK sourcing circuits 1055 produces aregister-strobing event, the event is presented in the ADRCLK0 signalHIC line 1057, transferred onto SVIC 1060 by way of control-transfercoupling 1067, and then further transferred by way ofcontrol-acquisition coupling 1065 onto line 1015 for presentation to aclock input of the first address-capturing register 1011 as the ADRCLK1signal. In response, the first address-capturing register 1011 capturesa respective ADR_SV1 signal that is presented on line 1019 to its Dinput. The ADR_SV1 signal is acquired from the SVIC 1060 by a respectivecontrol-acquisition coupling 1064.

Reference numeral 1062 points to two control-transfer couplings fromwhich the ADR_SV1 signal may be derived. A first of thesecontrol-transfer couplings is situated for selectively acquiring (ornot) an ADR_(—)2×L signal from a HIC line identified as 1051 andtransferring the ADR_(—)2×L signal to a programmably-selectable one oflines in SVIC 1060. HIC line 1051 corresponds in one embodiment to ahorizontal line found in one of the respective 2×L, 4×L, 8×L buses 852,854 and 858 of FIG. 8. The HIC of line 1051 does not need to beimmediately adjacent to SRAM array 1010. It can be any HIC that crossesoperatively with SVIC 1060.

A second of control-transfer couplings 1062 is situated for selectivelyacquiring (or not) an ADR_MaxL signal from a HIC line identified as 1052and transferring the ADR_MaxL signal to a programmably-selectable one oflines in SVIC 1060. HIC line 1052 corresponds in one embodiment to ahorizontal line found in the MaxL bus 859 of FIG. 8. The HIC of line1052 does not need to be immediately adjacent to SRAM array 1010 or thesame as that of line 1051. It can be any HIC that crosses operativelywith SVIC 1060. For purpose of convenient illustration however, both oflines 1051 and 1052 are shown as residing in a single HIC that isidentified as 1050.

For a first example, it is assumed that the ADR_SV1 signal (1019) isderived from the ADR_(—)2×L signal (1051). In its turn, the ADR_(—)2×Lsignal (1051) is obtained from a Q output of a register 1022 within aCSE of logic circuitry 1020. The CSE register 1022 corresponds in oneembodiment to 667 of FIG. 6B. CSE register 1022 has a clock input 1022athat is clocked by logic circuit portion 1021, where the latter portion1021 typically includes a VGB common controls section such as 550 ofFIG. 6A and a polarity-selecting multiplexer such as 603 of FIG. 6B.Logic circuit portion 1021 is responsive to the ADRCLK3 signal that isrouted to it by (H/V)IC interconnect resources 1001. Logic circuitportion 1021 may be further responsive to one or more other inputsignals represented by input path 1021a such that the ADRCLK3 signal isblocked from evoking a register-strobing event on line 1022a until anenabling signal is supplied on input path 1021a. The logic circuitportion 1021 may include variable grain, configurable logiccorresponding to one or more of the CBB's 510, 520, 530 and 540 of FIG.6A. The input path 1021a may correspond to parts 664, 604 of FIG. 6B aswell as common controls section 550 of FIG. 6A.

CSE register 1022 maintains its old Q output state until logic circuitportion 1021 provides a new register-strobing event to clock input1022a. The Q output state of CSE register 1022 is passed by way of aCSEQ portion 1023 to CSE output line 1024 so as to define a current orOLD ADDR1 signal. In one embodiment, CSEQ portion 1023 corresponds tomultiplexers 668, 620 and driver 630 of FIG. 6B. PIP 1025 isrepresentative of any user-programmable routing means that may be usedto couple the signal of line 1024 onto HIC line 1051. In one embodiment,PIP 1025 includes at least one of the programmable coupling elements632, 633, 634 and 638 of FIG. 6B.

CSED portion 1026 of FIG. 10 presents a next or NEW ADDR1 signal (1027)to the D input of CSE register 1022. In one embodiment, CSED portion1026 corresponds to multiplexer 640 of FIG. 6B. The NEW ADDR1 signal1027 may be generated by configurable logic that feeds into CSED portion1026 and may correspond for example to one inputs 675, 635 and 638 ofFIG. 6B. By way of example, such a NEW ADDR1 feeding logic may comprisean address counter (not shown) that is implemented by a plurality ofCBB's. In such a case, the carry-propagating logic section 570 of FIG.6A may cooperate with its respective in-VGB Configurable Building Blocks510-540 to produce each successive NEW ADDR1 signal. The NEW ADDR1signal may be alternatively computed by other logic means such as forexample that which utilizes the wide-gating logic section 560 of FIG.6A. As yet another alternative, the NEW ADDR1 signal may be generatedoutside the FPGA array and may be brought into the FPGA array by way ofone or more IOB's.

When logic circuit portion 1021 provides a new register-strobing eventto clock input 1022a, the CSE register 1022 captures the NEW ADDR1signal 1027 then presented to it and CSEQ 1023 forwards this newlystored signal 1027 onto CSE output line 1024. The new address signalthen flows through routing means 1025, line 1051, the upper ofcontrol-transfer couplings 1062, the SVIC 1060 and control-acquisitioncoupling 1064 to define the ADR_SV1 signal (1019) at the D input offirst address-capturing register 1011. When the ADR_SV1 signal (1019)stabilizes into a valid state at the D input of 1011, the ADRCLK1 signal(1015) may present a strobing-event to first address-capturing register1011 for causing register 1011 to capture the stabilized ADR_SV1 signal(1019).

The flow of the ADRCLK1 signal (1015) follows the path already describedabove, namely, from one of the ADRCLK sourcing circuits 1055, to HICline 1057, to control-transfer coupling 1067, through SVIC 1060, thenthrough control-acquisition coupling 1065 to line 1015. The CSEregister-strobing signal of line 1022a may follow an overlapping andsimilar path at the same time. More specifically, the address-strobingsignal that travels on line 1057 for strobing first address-capturingregister 1011 may also continue from control-transfer coupling 1067, andthrough SVIC 1060 to exit from control-transfer coupling 1063 onto the(H/V)IC interconnect resources as the ADRCLK3 signal. If or when furtherenabled by enabling signal 1021a (if such further enabling is needed),the so-produced ADRCLK3 signal can invoke logic circuit portion 1021 tostrobe CSE register 1022 and thereby create a new (next) address signalon CSE output line 1024. The enabling signal 1021a, if used may be usedto indicate when the NEW ADDR1 signal 1027 is valid.

The signal propagation delay from the ADRCLK0 line 1057 to the ADRCLK1line 1015 should be at least approximately equal to and more preferablyshorter than the signal propagation delay from the same ADRCLKO line1057 to the clock input 1022a of CSE register 1022. This helps to assurethat the first address-capturing register 1011 has safely captured andstored the old address signal previously presented on CSE output line1024 before the new state change of CSE register 1022 propagates to theD input 1019 of the first address-capturing register and presents itselfas a new ADR_SV1 signal.

Given that the first address-capturing register 1011 can safely captureand maintain the OLD ADDR1 value for subsequent processing by SRPM array1010, the memory cell addressing operations and the responsive datafetching operations of SRAM array 1010 can overlap in time with theproduction by logic circuitry 1020 of a next or NEW ADDR1 signal (1027)and the forwarding of this NEW ADDR1 signal to the D input 1019 of thefirst address-capturing register 1011. System response time may beadvantageously minimized by such temporal overlapping of operations.Moreover, the interconnect resources of the SVIC 1060 may beadvantageously used to serve the double-duty of transferring aregister-strobing event (ADRCLK0) simultaneously to the clock input 1015of the first address-capturing register 1011 and to the clock input1022a of the CSE register 1022. Such double-duty use of interconnectresources within the FPGA array helps to improve resource utilizationefficiency and frees other parts of the finite interconnect resourceswithin the FPGA array for other uses.

There is more than one way to transfer a new address signal into thefirst address-capturing register 1011. For purposes of a second example,it is assumed that the ADR_SV1 signal (1019) is instead derived from theADRrMaxL signal (1052). The signal flow for this second example is fromMaxL line 1052, through the lower of the control-transfer couplings1062, then through control-acquisition coupling 1064 onto line 1019.

For its part, the ADR_MaxL signal (1052) is obtained from a tristateoutput of a line-mastering one of plural tristate drivers such as 1031and 1032. MaxL tristate driver 1031 has an input terminal 1033, anoutput terminal coupled to HIC line 1052, and output enabling terminal1035 for switching the state of the driver's output terminal between ahigh-impedance (Hi-z) state and an active state. Similarly, MaxLtristate driver 1032 has an input terminal 1034, an output terminalcoupled to HIC line 1052, and output enabling (OE) terminal 1036 forswitching the state of the driver's output terminal between a Hi-z stateand an active state. The input and OE terminals, 1033 and 1035 of firstMaxL driver 1031 are driven by a ‘shared’, tristate-drivers controllingblock (3S_CTL) 1037. In one embodiment, the 3S_CTL block 1037corresponds to shared block 580 of FIG. 6A. Controlling block 1037 canhowever take other forms such as ones where it is not shared by pluralVGB's and/or plural CBB's.

A to-tristate signal 1041 may be fed from CSEQ 1023 to the 3S_CTL block1037 for presentation onto input terminal 1033 of first MaxL driver1031. The to-tristate signal 1041 may be one that is also stored in CSEregister 1022 or not. In one embodiment, the line of signal 1041corresponds to line 548 of FIGS. 6A and/or 6B. If OE terminal 1035 isset for the active output mode, the signal presented on input terminal1033 will be output to MaxL line 1052. If OE terminal 1035 is insteadreset for effecting Hi-z output mode, the signal presented on inputterminal 1033 will not be output to MaxL line 1052 and another MaxLdriver (e.g., 1032) may instead drive line 1052. The state of OEterminal 1035 may be controlled by dynamically-variable signal 1045. Inone embodiment, the line of signal 1045 corresponds to line 558 (DYOE)of FIG. 6A.

The input and OE terminals, 1034 and 1036 of second MaxL driver 1032 aredriven by a respective second ‘shared’, tristate-drivers controllingblock (3S_CTL) 1038. In one embodiment, the second 3S_CTL block 1038corresponds to shared block 580 (FIG. 6A) of an SVGB other than the SVGBthat contains the first 3S_CTL block 1037. Second controlling block 1038can however take other forms such as ones where it is not shared byplural VGB's and/or plural CBB's.

A second to-tristate signal 1042 may be fed from an appropriate source(e.g., a counterpart of CSEQ 1023) to the second 3S_CTL block 1038 forpresentation onto input terminal 1034 of second MaxL driver 1032. Thesecond to-tristate signal 1042 may be one that is also stored in a CSEregister or not. If OE terminal 1036 is set for the active output mode,the signal (NEW_ADDR_M2) presented on input terminal 1034 will be outputto MaxL line 1052. If OE terminal 1036 is instead reset for effectingHi-z output mode, the signal presented on input terminal 1034 will notbe output to MaxL line 1052 and another MaxL driver (e.g., 1031) mayinstead drive line 1052. The state of OE terminal 1036 may be controlledby dynamically-variable signal 1046. In one embodiment, the line ofsignal 1046 corresponds to a DyOE line (558) of an SVGB other than theSVGB that contains the first 3S_CTL block 1037.

Configurable logic block 1040 may be used to coordinate the switching ofmastery over MaxL line 1052 as between tristate drivers 1031, 1032 andothers if applicable. A change-over to a new address bit on MaxL line1052 may be carried out by switching the mastery over MaxL line 1052between tristate drivers such as 1031 and 1032. The full address wordthat is presented to first address input 1013 will of course be definedon a plurality of parallel lines, which lines can be comprised of one orboth of MaxL lines and 2×L, 4×L, and/or 8×L lines. FIG. 5 for exampleillustrates how a nibble's-worth of data may be transferred from anyside of block 580 to adjacent MaxL lines. As such, the change-over to anew address that is discussed here for tristate drivers 1031 and 1032may apply in parallel to a bus wide group of such tristate drivers.Alternatively, if the bit on line 1052 represents a significant addressbit, the changeover of such a single bit can have uses.

The ADRCLK3 signal may be used to coordinate switchover of mastery overMaxL line 1052 as follows. Instead of, or in addition to being routed tologic circuit portion 1021, the ADRCLK3 signal may be routed via (H/V)ICresources 1001 to terminal 1043 of configurable logic block 1040. Block1040 (which block can be a CBB, or VGB or other variable graincomponent) will respond by cycling the mastery over MaxL line 1052through tristate drivers 1031, 1032 and others if applicable. Thechanged state on line 1052 then propagates to define the ADR_SV1 signal(1019) as explained above. In other words, the signal on terminal 1043may be used as an address-changing control signal that deactivates theoutput enabling terminal 1035 of tristate driver 1031 and thereby allowsanother tristate drive (e.g., 1032 or that of an IOB) to take overmastery of line 1052.

Alternatively, while first MaxL driver 1031 has mastery over MaxL line1052, changes in the to-tristate signal 1041 may be propagated throughelements 1037, 1031 and line 1052 to thereby define the ADR_SV1 signal(1019) as explained above. The change of state of the to-tristate signal1041 may be made to occur in response to a change of state of theADRCLK3 signal. In view of the above, it is seen that a variety ofmechanisms can be made to respond to the ADRCLK0 and/or the ADRCLK3signals or derivations thereof such that the first address-capturingregister 1011 safely captures a first address value for presentation tofirst address input 1013 while at approximately the same time or shortlythereafter, a new second address value can begin to propagate towardsthe D input (1019) of the first address-capturing register.

The above descriptions for how a first address value is safely capturedin address-capturing register 1011 while at approximately the same timeor shortly thereafter, a new second address value can begin to propagatetowards the D input of that address-capturing register can equally applyto the second or PORT#2 address-capturing register 1012 with theexception that the signal presented to the D input of the latterregister 1012 is denoted in the illustration as ADR_SV2 and itscontrol-acquisition coupling is denoted as 106C. In the embodimentwherein line 1015 services the clock inputs of both of registers 1011and 1012, both address-capturing operations will of course occur inresponse to the ADRCLK1 signal. In the embodiment wherein line 1015services the clock input of register 1011 while separate line 1016 andcontrol-acquisition coupling 1066 services the clock input of register1012, each respective address-capturing operation will of course occurin response to the respective ADRCLK1 or ADRCLK2 signal. Separatesources 1055 may then be used respectively for each of the ADRCLK1 andADRCLK2 signals and separate versions of the ADRCLK3 and its associatedcircuits may also then be used respectively for each of the first andsecond address-capturing registers, 1011 and 1012.

On the data transfer side of SRAM array 1010, data-capturing registerssuch as the illustrated 10R1, 10R2 and 10R3 may be similarly used tosynchronize the transfer of data from and/or to the SRAM array 1010during respective read and write operations.

More specifically, during write operations to Port#1, data may passthrough respective ones of user-programmable interconnect points 1075 towrite buffer 10B1 from either horizontal MaxL lines such as the onedesignated as 10A2 in FIG. 10, and/or from further lines that arehorizontal 2×L, 4×L, and/or 8×L lines and are represented by the onedesignated as 10A1 in FIG. 10. Actuation of read/write clock signal,RWCLK1 causes data-capturing register 10R1 to capture and store the datathen presented to its D input. The captured data is then presented bythe Q output of register 10R1 to the D_(in) data-input section of Port#1for writing into a correspondingly addressed part of the SRAM array1010.

With the write data safely captured in data-capturing register 10R1, thelogic circuitry 1070 which supplies the write data may begin to generatenext write data even while SRAM array 1010 is busy receiving the datastored in data-capturing register 10R1. It should be apparent from FIG.10 that the various parts of logic circuitry 1070 are referenced withnumbers that are 50 greater than counterpart elements of circuitry 1020and therefore a detailed repetition of their operations will not berepeated here. Configurable logic 1071 may be made responsive to thesignal designated as RWCLK3 and which is transmitted by the configurableinterconnect resources designated as (H/V)IC 1002. The RWCLK3 signal mayoriginate as a RWCLK0 signal that is placed on HIC line 1058 and issourced by one or more of RWCLK sourcing circuits 1054. Control-transfercoupling 1068 selectively transfers the RWCLK0 signal onto a line ofSVIC 1060. Control-acquisition coupling 1061 selectively transfers thethere-received version of the RWCLK0 signal to the clock input ofdata-capturing register 10R1. The there-received version is referencedas the RWCLK1 signal. Control-transfer coupling 106A selectivelytransfers the there-received version of the RWCLK0 signal to (H/V)ICresources 1002. The latter there-received version is referenced as theRWCLK3 signal. Due to inherent time delays, CSE register 1072 will notcause a new write-data signal to be output onto CSE output line 1074until the previous write data signal is safely captured indata-capturing register 10R1. Similarly, configurable logic block 1090will not cause a switching of mastery over Max line 10A2, if thatmechanism is being used, until the previous write data signal is safelycaptured in data-capturing register 10R1.

Synchronization for the transfer of read data from SRAM array 1010 toother parts of the FPGA array may follow a similar scheme. The RE1section of SRAM array 1010 corresponds to line 979 of FIG. 9. The RE2section of SRAM array 1010 corresponds to line 969 of FIG. 9. The RWCLK1signal strobes the read-data capturing register 10R2 first before aRWCLK3′ signal enables RE1 to allow a next read operation by Port#1.

The RWCLK3′ signal can be either the same as the RWCLK3 signal or afurther delayed version thereof.

For the Port#2 side, the corresponding The ROCLK1 signal strobes theread-data capturing register 10R3 first before a ROCLK3′ signal enablesRE2 to allow a next read operation by Port#2. The ROCLK3′ signal can beeither the same as the ROCLK3 signal obtained by control-transfercoupling 106B or a further delayed version thereof.

The respective tristate output drivers, 10B2 and 10B3 of Port#1 andPort#2 should not be enabled until after the respective RWCLK1 andROCLK1 signal strobes the respective read-data capturing register, 10R2and 10R3, and the respective Q output of that register stabilizes into avalid state. As such, the respective RWCLK3″ and ROCLK3″ signals areaccordingly timed to provide such a delayed action as they pass throughoptional logic sections 10D1, 10D2 into respective OE control sections10E1, 10E2. The respective RWCLK3″ and ROCLK3″ signals may the same asthe RWCLK3 and ROCLK3 signals or may be other derivatives of the RWCLK0and ROCLK0 signals that originate from circuits 1054, 1053 and passthrough control-transfer couplings 1068 and 1069 for distribution bySVIC 1060 to control-acquisition couplings such as 106A and 106B.

Although FIG. 10 shows various couplings for transferring address anddata signals between CSE's (e.g., 1022, 1072) and SRAM array 1010, itshould now be apparent that similar types of synchronizing arrangementsmay be made for transferring one or both of address and data signalsbetween IOB's and the SRAM array 1010. More specifically, in FIG. 7B itwas shown that clocked registers 720 and 750 are provided for sendingdata out of and into the FPGA array. In FIG. 7C it will shown that thecount signals for registers 720 and 750 may be acquired from adjacentinterconnect lines and that the output of register 750 and input ofregister 720 may be programmably coupled to further interconnect linesof the FPGA array. Accordingly, IOB registers 720 and 750 may be used inthe essentially the same ways as the CSE registers 1022 and 1072 in FIG.10 for synchronizing transfer of address and data between the SRAM array1010 and the IOB's. Also, because the IOB's of FIG. 7B have tristatedrivers such as 761 and 762, the latter tristate drivers may be used inthe essentially the same ways as are drivers 1031, 1032, etc. in FIG. 10for synchronizing transfer of address and data between the SRAM array1010 and the IOB's.

Referring in FIGS. 11A-11B, shown there are an FPGA configuring processand a flow chart of a software process for causing one or more of theoperations of FIG. 10 to occur when a Variable Grain Architecture FPGAarray of the invention is configured.

More specifically, FIG. 11A is a schematic diagram of an FPGAconfiguring process 1100 wherein a predefined design definition 1101 issupplied to an FPGA compiling software module 1102. Module 1102processes the supplied information 1101 and produces an FPGA-configuringbitstream 1103. Bitstream 1103 is supplied to an FPGA such as 100 or1000 of respective FIGS. 1 and 11 for accordingly configuring the FPGA.

The design definition 1101 may include a SRAM module 1110, anaddress-source module 1120 and a data-I/O module 1170.

Although it may appear from the drawing that modules 1110, 1120 and 1170are pre-ordained to respectively correspond to elements 1010, 1020 and1070 of FIG. 10, that is not inherently true. The design definition 1101may be expressed in a variety of ways which do not pre-ordain such anoutcome. Modern circuit designs typically start with a Very High-levelDescriptor Language (VHDL) or the like for defining the behavior of ato-be-implemented design at a level that is significantly higher than agate-level or transistor level description. High level designdefinitions are often entered by designers into computer-implementedprogram that are commonly referred to by names such as VHDL synthesistools. The output of the VHDL synthesis tools may be in the form of oneor more computer files that constitute VHDL descriptions of theto-be-implemented design. VHDL description files may include one or moredifferent kinds of constructs including VHDL Boolean constructs thatdefine part or all of the design. The complexity of the Booleanfunctions can span a spectrum having very simple ones (e.g., thosehaving 1-3 input terms) at one end to very complex ones at the otherend. The high level definitions generally do not specifyimplementational details. That job, if an FPGA is to be used forimplementation, is left to the FPGA compiler software module 1102.

In the illustrated design definition 1101, there is a specification forthe address-source module 1120 to supply a valid address signal to anaddress input section (A_(in)) of the SRAM module 1110 at some generalfirst time point t₁. This presentation of a valid address issymbolically represented in FIG. 11A by presentation step symbol 1121.

Further in the illustrated design definition 1101, there is aspecification for the data I/O module 1170 to supply or receive a validdata signal respectively to or from a data input/output (D_(in/out))part of the SRAM module 1110 at some second general time point, t₂. Thispresentation of valid data is symbolically represented in FIG. 11A bydata presentation step symbol 1171. The second time point, t₂ can bebefore, after or coincident with the first time point, t₁. FIG. 11Ashows t₂ following t₁ merely for sake of example.

Yet further in the illustrated design definition 1101, there is aspecification for a memory read or memory write operation to occur atsome third general time point, t₃ based on the presentation of validaddress and data signals in respective steps 1121 and 1171. Thisexecution of a memory read or memory write operation is symbolicallyrepresented in FIG. 11A by execution step symbol 1180.

It should be apparent from the way the elements in area 1101 were drawnthat, ultimately, the address-source module 1120 will present addresssignals onto HIC bus 1152 and that these will then be transferred ontoSVIC bus 1160 for presentation to the address input section (A_(in)) ofthe SRAM module 1110 at a first time point corresponding to t₁. Also,when the design 1101 is ultimately implemented, the data I/O module 1170will exchange data signals with the data input/output (D_(in/out)) partof the SRAM module 1110 by way of HIC bus 1150 at time pointscorresponding to t₂ and t₃. However the road to this ultimate goal isnot embarked upon until the FPGA compiling software module 1102 inputsthe design definition 1101 and processes it as will now be described.

FIG. 11B illustrates a flow chart 1105 of a process that attempts torealize the above-described efficiencies of FIG. 10. A design definitionsuch as 1101 is input at step 1107 into the FPGA compiler softwaremodule 1102. Numerous processing steps may take place within softwaremodule 1102.

Step 1107 is one of those steps in which the software module 1102searches through the input design definition (e.g., 1101) for thepresence of design components like 1110, 1120 & 1170 that will performmemory read and/or write operations. The search criteria may optionallyrequire the searched-for design components to operate in a nibble-wideor word-wide parallel mode so that they may share one synchronizingclock for plural address or data bits.

At step 1108, if two or more design components like 1110, 1120 & 1170are found to satisfy the search criteria, the place-and-routedefinitions of those design components are repacked so as to urge thosedefinitions toward ultimately ending up using an SRAM array like 1010 ofFIG. 10 in combination with a controls-transferring bus like 1060 ofFIG. 10 and in further combination with exchange synchronizing registerslike 1011, 1012, 10R1, 10R2, 10R3 of FIG. 10.

It is understood by those skilled in the art of FPGA configuration thatmany design factors may pull the design components like 1110, 1120 &1170 away from or into operative placement next to shared busescorresponding with HIC's 1150 and 1152, where HIC 1150 is operativelyadjacent to the data input/output (D_(in/out)) part of the SRAM module1110. Some overriding design considerations may push them apart fromsuch an optimal arrangement. The urging factor produced in step 1108 maytherefore be just one of numerous place and route weighting factors thatpull one way or another to position the placed components in suchcooperative alignment.

Dashed path 1190 represents many other processes within the softwaremodule 1102 wherein the original design definition 1101 is transformedby steps such as design-partitioning, partition-placements andinter-placement routings to create a configuration file for the targetFPGA 100 or 1000. Step 1109 assumes that at least one set of designcomponents like 1110, 1120 & 1170 were found and were ultimatelypartitioned and placed together with minimal-time routing resources suchas 1150 and 1152 so as to allow for the optimized use of acontrols-transferring bus like 1060 of FIG. 10 in further combinationwith one or more exchange synchronizing registers like 1011, 1012, 10R1,10R2, 10R3 of FIG. 10. In that case, at step 1109 the target FPGA 100(0)is configured to use a controls-transferring bus like 1060 of FIG. 10 infurther combination with one or more exchange synchronizing registerslike 1011, 1012, 10R1, 10R2, 10R3 of FIG. 10 for providing the specifiedaddress and data transfers that take place between design componentslike 1110, 1120 & 1170.

The above disclosure is to be taken as illustrative of the invention,not as limiting its scope or spirit. Numerous modifications andvariations will become apparent to those skilled in the art afterstudying the above disclosure.

By way of example, instead of having only two columns of embedded memoryrespectively designated for the TOP longline set and the 3RD longlineset, it is also within the contemplation of the invention to providefour columns of embedded memory respectively designated for the TOPthrough 3RD longline sets. Different numbers of columns of embeddedmemory may also be provided.

Given the above disclosure of general concepts, principles and specificembodiments, the scope of protection sought is to be defined by theclaims appended hereto.

1. A field programmable gate array (FPGA) device comprising: (a) a firstplurality, P1 of repeated logic units wherein: (a.1) each said logicunit is user-configurable to acquire and process at least a secondplurality, P2 of input logic bits and to responsively produce resultdata having at least a third plurality, P3 of output logic bits, (a.2)said logic units are distributed among a plurality of horizontal rows,with each row of the plurality of rows having a fourth plurality, P4 ofsaid logic units; (b) a fifth plurality, P5 of horizontal interconnectchannels (HIC's) correspondingly distributed adjacent to said horizontalrows of logic units, wherein: (b.1) each said horizontal interconnectchannel (HIC) includes at least P3 interconnect lines, and (b.2) eachsaid horizontal row of P4 logic units is configurably couplable to atleast a corresponding one of the P5 HIC's at least for acquiring inputlogic its from the corresponding HIC and for outputting result data tothe corresponding HIC; (a.3) wherein each of said logic unit caninternally process its respective second plurality of input logic bitswithout using said horizontal interconnect channels or other generalinterconnect for such internal processing: and (c) an embedded memorysubsystem, wherein said embedded memory subsystem includes: (c.1) asixth plurality, P6 of independently-useable memory blocks, and wherein:(c.1a) each said independently-useable memory block is embedded withinone of said rows of logic units and is configurably couplable to thecorresponding HIC of said row for transferring storage data by way ofthe corresponding HIC of that row of P4 logic units; and (c.1b) each ofsaid memory blocks includes at least a first address-capturing registerthat is programmably couplable to at least one of said HIC's forreceiving and capturing in synchronism with a supplied address-strobingsignal, an address signal supplied on said at least one HIC; (c.1c) eachof said memory blocks includes at least a first data-capturing registerfor capturing said storage data in synchronism with a supplied firstdata-strobing signal; and (c.1d) each first address-capturing registeris clockable by a first address-strobing signal that is independent ofthe first data-strobing signal.
 2. A FPGA device according to claim 1wherein: (a.3) said logic units are further distributed among aplurality of vertical columns, with each column of the plurality ofcolumns having a seventh plurality, P7 of said logic units; and (c.1b1)plural ones of said memory blocks are arranged to define one or morecolumns of embedded memory within said FPGA device with each such columnhaving an eighth plurality, P8 of said memory blocks.
 3. A fieldprogrammable gate array device according to claim 2 wherein: (c.1c1)each said memory block is organized as a ninth plurality, P9 ofaddressable sets of storage data bits, where each addressable set ofstorage data bits includes at least P3 bits that are transferable by wayof the corresponding HIC of its corresponding row of P4 logic units,said P3 plurality of bits corresponding to the P3 plurality of outputlogic bits producible by each said logic unit.
 4. A field programmablegate array device according to claim 3 wherein: (c. 1c2) each of P2 andP3 is an integer equal to or greater than
 4. 5. A field programmablegate array device according to claim 1 wherein: (a.3) groups of saidlogic units are further wedged together such that no HIC's pass betweenthe wedged together logic units, and such that each group of logic unitsdefines a logic superstructure; and (c.1c2) groups of said memory blocksare also wedged together such that no HIC's pass between the wedgedtogether memory blocks, and such that each group of memory blocksdefines a memory superstructure that is configurably-couplable to acorresponding logic superstructure.
 6. A field programmable gate arraydevice according to claim 1 wherein said embedded memory subsystemincludes: (c.2) at least one special interconnect channel for supplyingaddress signals to the first address-capturing registers of a respectiveset of said memory blocks.
 7. A field programmable gate array deviceaccording to claim 6 wherein: (c.1b1) there are at least two of saidcolumns of embedded memory; and (c.2a) there are at least two of saidspecial interconnect channels, and each respective special interconnectchannel is for supplying address signals to a respective one of the atleast two columns of embedded memory.
 8. A field programmable gate arraydevice according to claim 6 wherein: (c.1c3) each said memory block hasat least first and second data ports each for outputting storage data;(c.1d) each said memory block has at least first and second addressports each for receiving address signals identifying the storage data tobe output by a corresponding one of the at least first and second dataports; (c.1e) each said memory block has in addition to said respectivefirst address-capturing register, a second address-capturing registerthat is programmably couplable to at least one of said HIC's forreceiving and capturing an address signal supplied on said at least oneHIC, and said first and second address-capturing registers respectivelyservice the first and second address ports; and (c.2a) the at least onespecial interconnect channel includes first and second address-carryingcomponents along which independent address signals may be respectivelycarried for application to respective ones of the first and secondaddress ports of at least two memory blocks.
 9. A field programmablegate array device according to claim 6 wherein: (c.1d) each said memoryblock has a controls-receiving port for programmably acquiring from saidat least one special interconnect channel, control signals that controloperations of said memory block; and (c.1e) said first address-strobingsignal is acquired by said controls-receiving port.
 10. In a fieldprogrammable gate array device (FPGA) having a user-configurableinterconnect network that includes a plurality of horizontalinterconnect channels each with a diversified set of long-haulinterconnect lines and shorter-haul interconnect lines, an embeddedmemory subsystem comprising: (a) a plurality of multi-ported memoryblocks each arranged adjacent to a horizontal interconnect channel (HIC)of the interconnect network; wherein: (a.1) each multi-ported memoryblock includes a first, independently-addressable data port and asecond, independently-addressable data port; (a.2) each of said firstand second, independently-addressable data ports includes a respectiveaddress-capturing register that is connectable by user-configurableintercouplings to one or both of the long-haul interconnect lines andthe shorter-haul interconnect lines for capturing a respective addresssignal in synchronism with a supplied, address-strobing signal; and(a.3) each of said first and second, independently-addressable dataports includes a respective, read data-capturing resister that isconnectable by user-configurable intercouplings to at least thelong-haul interconnect lines for capturing respective read data of theport independently of the address-strobing signal and for outputting thecaptured read data to the long-haul interconnect lines.
 11. In an FPGAdevice having a plurality of variable grain, configurable logic blocks(VGB's) and VGB interconnect resources including lines of diversifiedcontinuous lengths for interconnecting said VGB's, an embedded memorysubsystem comprising: a special interconnect channel, programmablycouplable to said VGB interconnect resources: and a plurality of memoryblocks wherein each memory block includes: (a) at least a firstaddress-capturing register that is programmably couplable to said VGBinterconnect resources by way of said special interconnect channel forreceiving and capturing a respective first address signal supplied byway of said VGB interconnect resources and said special interconnectchannel; and (a.1) address-strobing means for strobing the firstaddress-capturing register by way of said VGB interconnect resources andsaid special interconnect channel, where said address-strobing can occurindependently of data-capture strobing for corresponding data.
 12. Theembedded memory subsystem of claim 11 wherein each memory block furtherincludes: (b) a second address-capturing register that is programmablycouplable to said interconnect resources for receiving and capturing arespective second address signal supplied by way of said VGBinterconnect resources.
 13. The embedded memory subsystem of claim 11wherein: (a.1) said first address-capturing register is furtherprogrammably couplable to said VGB interconnect resources by way thespecial interconnect channel for receiving a respective first addressclock signal to which the first address-capturing register isresponsive.
 14. A method for use in an FPGA device having pluralvariable grain blocks (VGB's), configurable interconnect resources withcontinuous conductors of diversified lengths, and an embedded memorysubsystem comprising a plurality of memory blocks situated forconfigurable coupling to the diversified interconnect resources, wherethe memory blocks each have at least one address input port and at leastone data port, the address input port having a respectiveaddress-capturing register, said method comprising the steps of: (a)outputting a first address signal for conveyance by at least part ofsaid interconnect resources to a respective first address-capturingregister of an address input port of a given memory block; (b)outputting a first address-strobing signal for conveyance by at leastpart of said interconnect resources to the respective firstaddress-capturing register to thereby capture the conveyed first addresssignal in the respective first address-capturing register of the givenmemory block; and (d) coupling the first address-strobing signal throughdelaying logic for thereby invoking a delay in outputting of a nextaddress signal for conveyance by at least part of said interconnectresources to the respective first address-capturing register of theaddress input port of the given memory block, said invoked delayassuring that the first address signal is captured by the respectivefirst address-capturing register before the outputting of said nextaddress signal.
 15. The method of claim 14 wherein at least one of saidstep (a) of outputting the first address signal and said step (d) ofcoupling the first address-strobing signal through delaying logicincludes the substep of: (a/d.1) transmitting the first address signalthrough a configurable sequential output element of a first of saidVGB's.
 16. The method of claim 15 wherein at least one of said step (a)of outputting the first address signal and said step (d) of coupling thefirst address-strobing signal through delaying logic includes thefurther substep of: (a/d.2) sourcing the first address signal from astorage register within a configurable sequential element of said firstof said VGB's.
 17. The method of claim 16 wherein at least one of saidstep (a) of outputting the first address signal and said step (d) ofcoupling the first address-strobing signal through delaying logicincludes the further substep of: (a/d.3) applying an address-changingclock signal to the storage register that sources the first addresssignal, where said address-changing clock signal is derived from thefirst address-strobing signal.
 18. The method of claim 14 wherein saidstep (a) of outputting the first address signal includes the substepsof: (a.1) transmitting the first address signal through a first ofplural tristate drivers, where each of the tristate drivers has anoutput enabling terminal; (a.2) providing an address-changing controlsignal that deactivates the output enabling terminal of the firsttristate driver, where said address-changing control signal is derivedfrom the first address-strobing signal.
 19. A method for configuring anFPGA device having plural variable grain blocks (VGB's), configurableinterconnect resources, and an embedded memory subsystem comprising oneor more memory blocks situated for configurable coupling via theconfigurable interconnect resources to the VGB's, where the memoryblocks each have at least one registered address input port forreceiving and storing supplied address bits, and where the memory blockseach further have at least one registered data output port for storingand outputting retrieved read-data, said method comprising the steps of:(a) defining a first route through and interconnect resources from anaddress signal sourcing circuit of the FPGA device to the at least oneregistered address input port; (b) defining a second route through saidinterconnect resources from an address clock sourcing circuit of theFPGA device to the at least one registered address input port; (c)defining a third route through said interconnect resources from theaddress clock sourcing circuit to an address-changing circuit of theFPGA device, the third route being configured such that a new addresssignal can be produced by action of said address-changing circuitsubstantially at the same time or shortly after an address clock signalof the address clock sourcing circuit clocks the at least one registeredaddress input port, said new address signal being produced so as to notinterfere with a current address signal captured by the registeredaddress input port; and (d) defining a fourth route through saidinterconnect resources from a read clock sourcing circuit of the FPGAdevice to the at least one registered data output port.
 20. A method forproducing configuration signals for configuring an FPGA device havingplural variable grain blocks (VGB's) configurable interconnectresources, and an embedded memory subsystem comprising one or morememory blocks situated for configurable coupling via the configurableinterconnect resources to the VGB's, where the memory blocks each haveat least one registered address input port for receiving and storingsupplied address bits in response to a supplied address-strobing signal,and where the memory blocks each have at least one registered dataoutput port for storing and outputting retrieved read-data, the storingof the retrieved read-data being in response to a supplied data-strobingsignal, said method comprising the steps of: (a) inputting a designdefinition; (b) searching the input design definition for the presenceof one or more memory modules, address-sourcing modules, and data-usingmodules that will cooperate to perform a memory read or memory writeoperation; and (c) encouraging the creation in the configured FPGA of ashared signal route that transmits an address-strobing clock signal tothe registered address input port and that transmits an address-changeallowing signal to one or more of the address-sourcing modules and thattransmits a data-strobing signal to one or more of the registered dataoutput ports.
 21. A field programmable gate array (FPGA) devicecomprising: (a) a plurality of configurable logic blocks (CLB's); (b)configurable CLB interconnect resources for configurably interconnectingsaid CLB's; (c) a memory subsystem comprising: (c.1) a plurality ofindependently-usable memory blocks each having: (c.1a) a shared array ofmemory cells; (c.1b) a first port unit coupled to the shared array andincluding a respective first data output port and a first address inputport; (c.1c) a second port unit coupled to the shared array andincluding a respective second data output port and a second addressinput port, wherein the first and second port units can simultaneouslyaccess the shared array of memory cells; (c.1d) first and secondaddress-capturing registers respectively coupled to the first and secondaddress input ports, each address-capturing register having address andclock inputs and an address output; (c.1e) first and second read-datacapturing registers respectively coupled to the first and second dataoutput ports, each data capturing register having data and clock inputsand a data output; (c.2) a configurable, first special interconnectchannel that is programmably couplable to said CLB interconnectresources, (c.2a) said first special interconnect channel extendingadjacent to a respective first group of said memory blocks; (c.2b) saidfirst special interconnect channel being further programmably couplableto the respective clock inputs of the first and second address-capturingregisters of said first group of memory blocks such that the respectiveclock inputs of the first and second address-capturing registers of oneor more memory blocks in the first group can be respectively driven byat least a first address-strobing signal which is transmitted by way ofthe first special interconnect channel; and (c.2c) said first specialinterconnect channel being further programmably couplable to therespective clock inputs of the first and second read-data capturingregisters of said first group of memory blocks such that the respectiveclock inputs of the first and second read-data capturing registers ofone or more memory blocks in the first group can be respectively drivenby independent first and second data-strobing signals which aretransmitted by way of the first special interconnect channel.
 22. TheFPGA device of claim 21 wherein: (c.2a1) said first special interconnectchannel is programmably couplable to the respective clock inputs of thefirst and second address-capturing registers of said first group ofmemory blocks such that the clock input of the first address-capturingregister of one or more memory blocks of the first group can berespectively driven by the first address-strobing signal and such thatthe clock input of the second address-capturing register of one or morememory blocks of the first group can be respectively driven by a secondaddress-strobing signal which is independent of the firstaddress-strobing signal and which is also transmitted by way of thefirst special interconnect channel.
 23. The FPGA device of claim 21wherein: (c.2c) the configurable, first special interconnect channel isfurther programmably couplable to the respective address inputs of thefirst and second address-capturing registers of said first group ofmemory blocks such that the respective address inputs of the first andsecond address capturing registers of one or more memory blocks of thefirst group can be respectively driven by independent first and secondaddress signals which are transmitted by way of the first specialinterconnect channel.
 24. The FPGA device of claim 21 wherein: (b.1) theconfigurable CLB interconnect resources include lines of diversifiedcontinuous lengths for configurably interconnecting said CLB's.
 25. TheFPGA device of claim 21 wherein: (a.1) at least a plurality of saidCLB's are constituted by variable grain blocks (VGB's) where each saidVGB is comprised of at least four Configurable Building Blocks (CBB's)and each CBB can output to adjacent parts of the CLB interconnectresources at least one bit of processed result data, the processedresult data bit being a configuration-defined function of at least threeinput term signals that are acquirable by the CBB from adjacent parts ofthe CLB interconnect resources.
 26. The FPGA device of claim 25 wherein:(a.1a) each said processed result data bit of a given CBB can beprogrammably defined to be a configuration-defined function of at leastsix input term signals that are acquirable by the CBB from adjacentparts of the CLB interconnect resources.
 27. The FPGA device of claim 25wherein: (a.1a) each said processed result data bit of a given CBB canbe programmably defined to be a configuration-defined function of atleast sixteen input term signals that are obtainable from parts of theCLB interconnect resources that neighbor the given CLB.
 28. The FPGAdevice of claim 25 wherein: (a.1a) each said processed result data bitof a given CBB can be programmably defined to be a result of an additionor subtraction operation carried out at least partially within the givenCBB.
 29. The FPGA device of claim 25 wherein: (b.1) said configurableCLB interconnect resources include continuous lines of diversifiedlength including lines of a first continuous length extending adjacentto at least two VGB's and lines of a second continuous length extendingadjacent to at least eight VGB's, the second continuous length being atleast twice the first continuous length.
 30. The FPGA device of claim 29wherein: (c.1c1) the second read-data capturing register of each memoryblock is programmably couplable to at least an adjacent one of the firstcontinuous length lines.
 31. The FPGA device of claim 30 wherein:(c.1c2) the second port unit of each memory block is a read-only portunit.
 32. The FPGA device of claim 27 wherein: (a.1a) said VGB's aredisposed to define vertical columns of VGB's and horizontal rows ofVGB's; and (b.1) said configurable CLB interconnect resources includecontinuous lines of diversified length including lines of a firstcontinuous length extending adjacent to at least two VGB's and lines ofa second continuous length extending adjacent to a respective full rowor a full column of VGB's, the second continuous length being at leastten times the first continuous length.
 33. The FPGA device of claim 32wherein: (c.1c1) the first and second read-data capturing registers ofeach memory block are each programmably couplable to a respective atleast one adjacent one of the second continuous length lines.
 34. TheFPGA device of claim 33 wherein: (c.1c2) the second port unit of eachmemory block is a read-only port unit while the first port unit of eachmemory block is a read-write port unit.
 35. The FPGA device of claim 21wherein: (c.1b1) said first port unit includes a respective first datainput port for receiving write data for writing into said shared arrayof memory cells; (c.1f) each given one of said memory blocks furtherincludes a respective first write-data capturing register respectivelycoupled to the first data input port of the given memory block, eachwrite-data capturing register having data and clock inputs and a dataoutput; (c.1f1) the respective clock input of each write-data capturingregister in a given one of said memory blocks can be respectively drivenby the corresponding first data-strobing signal of the given memoryblock.
 36. The FPGA device of claim 21 wherein: (c.2c) said firstspecial interconnect channel includes a plurality of continuousconductors of respectively diversified lengths including maximum lengthconductors for broadcasting to the first group of memory blocks commonaddress bits, and including shorter length conductors for conveyingother address bits to respective subsets the first group of memoryblocks.
 37. The FPGA device of claim 21 wherein: (c.2c) said firstspecial interconnect channel includes a plurality of continuousconductors of respectively diversified lengths including maximum lengthconductors for broadcasting to the first group of memory blocks commoncontrol bits, and including shorter length conductors for conveyingother control bits to respective subsets the first group of memoryblocks.
 38. The FPGA device of claim 37 wherein: (c.2c1) said firstspecial interconnect channel has global clock lines passing therethroughfor broadcasting to the first group of memory blocks programmablyacquirable global clock signals.
 39. The FPGA device of claim 21 andfurther comprising: (c.3) a configurable, second special interconnectchannel that is programmably couplable to said CLB interconnectresources, (c.3a) said second special interconnect channel extendingadjacent to a respective second group of said memory blocks; (c.3b) saidsecond special interconnect channel being further programmably couplableto the respective clock inputs of the first and second address-capturingregisters of said second group of memory blocks such that the respectiveclock inputs of the first and second address-capturing registers of oneor more memory blocks in the second group can be respectively driven byat least a second address-strobing signal which is transmitted by way ofthe second special interconnect channel; and (c.3c) said second specialinterconnect channel being further programmably couplable to therespective clock inputs of the first and second read-data capturingregisters of said second group of memory blocks such that the respectiveclock inputs of the first and second read-data capturing registers ofone or more memory blocks in the second group can be respectively drivenby independent third and fourth data-strobing signals which aretransmitted by way of the second special interconnect channel.
 40. Amethod of configuring a field programmable gate array (FPGA) devicewhere the FPGA device comprises: (0.1) a plurality of configurable logicblocks (CLB's); (0.2) configurable CLB interconnect resources forconfigurably interconnecting said CLB's; (0.3) a memory subsystemcomprising: (0.31) a plurality of independently-usable memory blockseach having: (0.31a) a shared array of memory cells; (0.31b) a firstport unit coupled to the shared array and including a respective firstdata output port and a first address input port; (0.31c) a second portunit coupled to the shared array and including a respective second dataoutput port and a second address input port; (0.31d) at least oneaddress-capturing registers respectively coupled to one of the first andsecond address input ports, the at least one address-capturing registerhaving address and clock inputs and an address output; (0.31e) at leastone read-data capturing register respectively coupled to one of thefirst and second data output ports, the at least one data capturingregister having data and clock inputs and a data output; (0.32) aconfigurable, special interconnect channel that is programmablycouplable to said CLB interconnect resources, (0.32a) said specialinterconnect channel extending adjacent to said memory blocks; (0.32b)said special interconnect channel being further programmably couplableto the respective clock inputs of the at least one address-capturingregisters of said memory blocks such that the respective clock inputs ofthe at least one address-capturing registers of one or more of thememory blocks can be respectively driven by at least a firstaddress-strobing signal which is transmittable by way of the specialinterconnect channel; and (0.32c) said special interconnect channelbeing further programmably couplable to the respective clock inputs ofthe at least one read-data capturing registers of said memory blockssuch that the respective clock inputs of the at least one read-datacapturing registers of one or more of the memory blocks can berespectively driven by a data-strobing signals which is transmittable byway of the special interconnect channel; said FPGA configuring methodcomprising: (a) configuring the special interconnect channel to supplyan address-strobing signal to the clock input of an address-capturingregister of a given one of said memory blocks; and (b) configuring thespecial interconnect channel to supply a data-strobing signal to theclock input of a read-data capturing register of the given one of saidmemory blocks such that the supplied address-strobing and data-strobingsignals can be independent of one another.
 41. The FPGA configuringmethod of claim 40 and further comprising: (c) configuring the specialinterconnect channel to supply an address signal to the data input of anaddress-capturing register of the given one of said memory blocks. 42.The FPGA configuring method of claim 41 and further comprising: (c)configuring a given one of said CLB's to be responsive to the suppliedaddress-strobing signal and to produce a next and later address signalfor the given memory block after said supplied address-strobing signalcauses the address-capturing register of the given memory block thecapture the earlier-supplied address signal.
 43. The FPGA configuringmethod of claim 41 and further comprising: (d) configuring a given oneof said CLB's to be responsive to the supplied address-strobing signaland to produce an output enabling signal that enables memory data to beoutput onto said CLB interconnect after the supplied data-strobingsignal causes a read-data capturing register of the given one of saidmemory blocks to capture resource memory read data.
 44. A fieldprogrammable gate array (FPGA) device comprising: (a) a plurality ofconfigurable logic blocks (CLB's); (b) configurable CLB interconnectresources for configurably interconnecting said CLB's; (c) a memorysubsystem comprising: (c.1) a plurality of independently-usable memoryblocks each having: (c.1a) a shared array of memory cells; (c.1b) afirst port unit coupled to the shared array and including a respectivefirst data output port and a first address input port; (c.1c) a secondport unit coupled to the shared array and including a respective seconddata output port and a second address input port, wherein the first andsecond port units can access respectively addressed part of the sharedarray of memory cells; (c.1d) first and second address-capturingregisters respectively coupled to the first and second address inputports, each address-capturing register having address and clock inputsand an address output; (c.1e) first and second read-data capturingregisters respectively coupled to the first and second data outputports, each data capturing register having data and clock inputs and adata output; (c.2) a configurable, first special interconnect channelthat is programmably couplable to said CLB interconnect resources,(c.2a) said first special interconnect channel extending adjacent to arespective first group of said memory blocks; (c.2b) said first specialinterconnect channel being further programmably couplable to therespective clock inputs of the first and second address-capturingregisters of said first group of memory blocks such that the respectiveclock inputs of the first and second address-capturing registers of oneor more memory blocks in the first group can be respectively driven byat least a first address-strobing signal which is transmitted by way ofthe first special interconnect channel; and (c.2c) said first specialinterconnect channel being further programmably couplable to therespective clock inputs of the first and second read-data capturingregisters of said first group of memory blocks such that the respectiveclock inputs of the first and second read-data capturing registers ofone or more memory blocks in the first group can be respectively drivenby one or more data-strobing signals which are independent of the firstaddress-strobing signal thereby allowing read-data-capture andaddress-capture operations by respective ones of the read-data capturingregisters and address-capturing registers to occur at different times,and wherein said one or more data-strobing signals are transmitted byway of the first special interconnect channel.
 45. The FPGA device ofclaim 44 wherein: (c.2a1) said first special interconnect channel isprogrammably couplable to the respective clock inputs of the first andsecond address-capturing registers of said first group of memory blockssuch that the clock input of the first address-capturing register of oneor more memory blocks of the first group can be respectively driven bythe first address-strobing signal and such that the clock input of thesecond address-capturing register of one or more memory blocks of thefirst group can be respectively driven by a second address-strobingsignal which is independent of the first address-strobing signal andwhich is also transmitted by way of the first special interconnectchannel.
 46. The FPGA device of claim 44 wherein: (c.2d) theconfigurable, first special interconnect channel is further programmablycouplable to the respective address inputs of the first and secondaddress-capturing registers of said first group of memory blocks suchthat the respective address inputs of the first and second addresscapturing registers of one or more memory blocks of the first group canbe respectively driven by independent first and second address signalswhich are transmitted by way of the first special interconnect channel.47. The FPGA device of claim 44 wherein: (b.1) the configurable CLBinterconnect resources include lines of diversified continuous lengthsfor configurably interconnecting said CLB's; and (c.2d) theconfigurable, first special interconnect channel is programmablycouplable to at least two different length conductors of said CLBinterconnect resources.
 48. The FPGA device of claim 44 wherein: (a.1)at least a plurality of said CLB's are constituted by variable grainblocks (VGB's) where each said VGB is comprised of at least fourConfigurable Building Blocks (CBB's) and each CBB can output to adjacentparts of the CLB interconnect resources at least one bit of processedresult data, the processed result data bit being a configuration-definedfunction of at least three input term signals that are acquirable by theCBB from adjacent parts of the CLB interconnect resources.
 49. The FPGAdevice of claim 48 wherein: (a.1a) each said processed result data bitof a given CBB can be programmably defined to be a configuration-definedfunction of at least six input term signals that are acquirable by theCBB from adjacent parts of the CLB interconnect resources.
 50. The FPGAdevice of claim 48 wherein: (a.1a) each said processed result data bitof a given CBB can be programmably defined to be a configuration-definedfunction of at least sixteen input term signals that are obtainable fromparts of the CLB interconnect resources that neighbor the given CLB. 51.The FPGA device of claim 48 wherein: (a.1a) each said processed resultdata bit of a given CBB can be programmably defined to be a result of anaddition or subtraction operation carried out at least partially withinthe given CBB.
 52. The FPGA device of claim 48 wherein: (b.1) saidconfigurable CLB interconnect resources include continuous lines ofdiversified length including lines of a first continuous lengthextending adjacent to at least two VGB's and lines of a secondcontinuous length extending adjacent to at least eight VGB's, the secondcontinuous length being at least twice the first continuous length; and(c.2d) the configurable, first special interconnect channel isprogrammably couplable to at least two different length conductors ofsaid CLB interconnect resources.
 53. The FPGA device of claim 52wherein: (c.1c1) the second read-data capturing register of each memoryblock is programmably couplable to at least an adjacent one of the firstcontinuous length lines.
 54. The FPGA device of claim 44 wherein:(c.1c1) the second port unit of each memory block is a read-only portunit.
 55. The FPGA device of claim 48 wherein: (a.1a) said VGB's aredisposed to define vertical columns of VGB's and horizontal rows ofVGB's; and (b.1) said configurable CLB interconnect resources includecontinuous lines of diversified length including lines of a firstcontinuous length extending adjacent to at least two VGB's and lines ofa second continuous length extending adjacent to a respective full rowor a full column of VGB's, the second continuous length being at leastten times the first continuous length.
 56. The FPGA device of claim 55wherein: (c.1c1) the first and second read-data capturing registers ofeach memory block are each programmably couplable to a respective atleast one adjacent one of the second continuous length lines.
 57. TheFPGA device of claim 56 wherein: (c.1c2) the second port unit of eachmemory block is a read-only port unit while the first port unit of eachmemory block is a read-write port unit.
 58. The FPGA device of claim 44wherein: (c.1b1) said first port unit includes a respective first datainput port for receiving write data for writing into a portion of saidshared array of memory cells that is addressed by the first addressinput port; (c.1f) each given one of said memory blocks further includesa respective first write-data capturing register respectively coupled tothe first data input port of the given memory block, each write-datacapturing register having data and clock inputs and a data output;(c.1f1) the respective clock input of each write-data capturing registerin a given one of said memory blocks can be respectively driven by thecorresponding first data-strobing signal of the given memory block. 59.The FPGA device of claim 44 wherein: (c.2d) said first specialinterconnect channel includes a plurality of continuous conductors ofrespectively diversified lengths including maximum length conductors forbroadcasting to the first group of memory blocks common address bits,and including shorter length conductors for conveying other address bitsto respective subsets the first group of memory blocks.
 60. The FPGAdevice of claim 44 wherein: (c.2d) said first special interconnectchannel includes a plurality of continuous conductors of respectivelydiversified lengths including maximum length conductors for broadcastingto the first group of memory blocks common control bits, and includingshorter length conductors for conveying other control bits to respectivesubsets the first group of memory blocks.
 61. The FPGA device of claim60 wherein: (c.2d1) said first special interconnect channel has globalclock lines passing therethrough for broadcasting to the first group ofmemory block programmably acquirable global clock signals, where theglobal clock signals are also programmably acquirable by said CLB's forsynchronizing operations of the CLB's.
 62. The FPGA device of claim 44and further comprising: (c.3) a configurable, second specialinterconnect channel that is programmably couplable to said CLBinterconnect resources, (c.3a) said second special interconnect channelextending adjacent to a respective second group of said memory blocks;(c.3b) said second special interconnect channel being furtherprogrammably couplable to the respective clock inputs of the first andsecond address-capturing registers of said second group of memory blockssuch that the respective clock inputs of the first and secondaddress-capturing registers of one or more memory blocks in the secondgroup can be respectively driven by at least a second address-strobingsignal which is transmitted by way of the second special interconnectchannel; and (c.3c) said second special interconnect channel beingfurther programmably couplable to the respective clock inputs of thefirst and second read-data capturing registers of said second group ofmemory blocks such that the respective clock inputs of the first andsecond read-data capturing registers of one or more memory blocks in thesecond group can be respectively driven by independent third and fourthdata-strobing signals which are transmitted by way of the second specialinterconnect channel; (c.3d) wherein said first and second specialinterconnect channels can programmably acquire same or different controlsignals from the CLB interconnect resources.
 63. The FPGA device ofclaim 44 wherein: (a.1) each of said plurality of CLB's is programmablycouplable to the first special interconnect channel by way of at leastone tristateable line drive such that different address signals can beinjected in time multiplexed fashion from the CLB's to the first specialinterconnect channel by enabling outputs of different tristateable linedrivers at different times; and (a.2) output enable terminals of saidtristateable line drivers can be programmably made responsive to said atleast first address-strobing signal such that injection of a new andreplacing address signal into the first special interconnect channel canbe blocked until a previous address signal has been captured by acorresponding one of the address-capturing registers in response to saidat least first address-strobing signal.
 64. The FPGA device of claim 44wherein: (c.1f) the data output ports of said first and second read-datacapturing registers can respectively couple to the CLB interconnectresources by way of first and second tristateable line drivers, whereeach tristateable line driver has a respective output enable terminal;(c.1g) the output enable terminals of said tristateable line drivers canbe programmably made responsive to said one or more data-strobingsignals such that injection of new and replacing data signals throughthe tristateable line drivers and into corresponding parts of the CLBinterconnect resources can be blocked until said replacing data signalshave been captured by corresponding ones of the data-capturing registersin response to said one or more data-strobing signals.
 65. The FPGAdevice of claim 44 and further comprising: (d) a plurality ofprogrammably configurable input/output blocks (IOB's) coupled to the CLBinterconnect resources and having configurable I/O storage means whichcan configured to operate in synchronism with at least the firstaddress-strobing signal.
 66. The FPGA device of claim 44 and furthercomprising: (d) a plurality of programmably configurable input/outputblocks (IOB's) coupled to the CLB interconnect resources and havingconfigurable I/O storage means which can configured to operate insynchronism with said one or more data-strobing signals.
 67. A fieldprogrammable gate array (FPGA) device comprising: a plurality ofconfigurable logic blocks (CLBs); a memory subsystem comprising aplurality of independently-usable memory blocks each having: an array ofmemory cells; a first address-capturing register coupled to a firstaddress port of the array, the first address-capturing register havingaddress and clock inputs and an address output; a secondaddress-capturing register coupled to a second address port of thearray, the second address-capturing register having address and clockinputs and an address output; a first read-data capturing registercoupled to a first data port of the array, the first read-data capturingregister having data and clock inputs and a data output; and a secondread-data capturing register coupled to a second data port of the array,the second read-data capturing register having data and clock inputs anda data output; and interconnect resources configurable to interconnectthe CLBs and the memory subsystem.
 68. The FPGA device of claim 67,wherein the first address port and first data port comprise a first portunit and the second address port and second data port comprise a secondport unit, and wherein the first and second port units are operable tosimultaneously access the array of memory cells.
 69. The FPGA device ofclaim 67, wherein the interconnect resources include a first specialinterconnect channel programmable to interconnect the CLBs and thememory subsystem.
 70. A method of configuring an FPGA device comprising:providing a memory subsystem comprising a plurality ofindependently-usable memory blocks each having an address-capturingregister and a read-data capturing register; configuring interconnectresources to supply an address-strobing signal to the address-capturingregister of a memory block; and configuring interconnect resources tosupply a data-strobing signal to the read-data capturing register of thememory block, wherein the address-strobing and data-strobing signals canbe supplied independent of one another.
 71. A field programmable gatearray (FPGA) device comprising: a plurality of configurable logic blocks(CLBs); a memory subsystem comprising a plurality ofindependently-usable memory blocks each having: an array of memorycells; a first address-capturing register coupled to a first addressport of the array, the first address-capturing register having addressand clock inputs and an address output; and a read-data capturingregister coupled to a first data port of the array, the first read-datacapturing register having data and clock inputs and a data output; andinterconnect resources configurable to interconnect the CLBs and thememory subsystem and configurable to supply an address-strobing signalto the address-capturing register and a data-strobing signal to theread-data capturing register, wherein the address-strobing anddata-strobing signals can be supplied independent of one another.